5558 pads results

Electronics Forum: pads (Page 74 of 556)

Question on Pad Size for ICT Test Points

Electronics Forum | Tue Aug 07 15:05:27 EDT 2001 | gdstanton

Anyone have an idea on what the smallest feasible/reliable pad size and pitch should be for a PCB designed with an array of ICT test points? Thanks in advance for your help.

black and grey pad

Electronics Forum | Sat Oct 06 08:42:21 EDT 2001 | davef

Please give us additional background on your board, solder, process, etc. If you are talking about black pad in ENIG solderability preservative, check the fine SMTnet archives to get started.

Can we hide extra long pad with solder mask ?

Electronics Forum | Fri Nov 09 11:55:49 EST 2001 | mparker

If you are getting solder shorts under a device, how would "hiding" the extra long pad with solder mask help? If the pad can't be seen once the device is in place, it is already "hidden". Getting your customer to redesign the pads may take some time

optimun height between lead and pad?

Electronics Forum | Tue Dec 04 06:16:50 EST 2001 | Andy

For conventional QFP device, what is the optimun height between lead and pad? 50 microns or 100 microns? What is the factor affecting this height?

SMT Round vs Square Pads

Electronics Forum | Sat Mar 30 17:42:33 EST 2002 | davef

Never read anything like that, but with the same courtyard, you have the ability to position less material with a circle than a square. Search the fine SMTnet Archives for a heirarchy of sources from which to select pad dimensions

Tilted/Slant SMT Component Specs?

Electronics Forum | Wed Mar 27 19:26:53 EST 2002 | ianchan

After a whole night's self review, I think we can term the slant/tilt as "floating 0805, yet end-terminals have acceptable solder joint formation". the width portion of the 0805 RES/CAP is (floating)elevated from the PCB pad, yet both (width) termin

0402 tombstoning

Electronics Forum | Thu Apr 11 20:35:22 EDT 2002 | davef

Messy. Messy. Messy. Consider gluing these components, until you control your process. It is unclear to us that a single factor drives these defects, but multiple factors that need to be tuned to work well together. PAD DIMENSIONS * Some SM-782 pa

force between the pad and laminate material

Electronics Forum | Thu Jun 20 03:15:22 EDT 2002 | Paul

I've seen a problem recently where there was 2 deposits of Nickle then Gold, The problem is the Nickle will not adhere to Nickle, see if you can scrape the pad away with a scalpel.

Solder balls on gold pad

Electronics Forum | Wed Jul 17 02:32:13 EDT 2002 | computer

Hi, Anybody with a solution on solder balls on gold pad. I have tried the following a) Check cleanliness of solder paste printing area b) Clean stencils on 1 clean per 2 prints c) Use N2 on the reflow oven. Any other methods...

SMT

Electronics Forum | Tue Aug 27 01:19:38 EDT 2002 | zolasteven

Hi, I have a few questions regarding printed circuit board. What is the difference between the solder pads and the solder resist or mask? What is the purpose for the solder resist? What color is it? When printing solder paste should the paste be