Electronics Forum | Fri Feb 19 16:45:55 EST 1999 | Steve Gregory
Hello Ryan! There's a company called Camalot that sells dispensers that in my opinion, make one of the better dispensers on the market. They use what's called a rotary-positive displacement pump when dispensing... much more precise and accurate
Electronics Forum | Mon Jan 04 11:32:59 EST 1999 | Chrys
| Anyone have any experience with ECD's Waverider/MOLE profiling equipment? If so, were they positive experiences? | I use ECD's mole for profiling in the wave and a KIC for profiling in reflow. I like the KIC a whole lot better for a couple of re
Electronics Forum | Wed Sep 02 07:16:20 EDT 1998 | Earl Moon
| | | We�ve been thinking again and need your help in sorting through an issue related to deionized (DI) water cleaning of assembled boards. | | | THE BACKGROUND: The water reclaiming systems goes: gross filter, fine filter, carbon bed, mixed resin
Electronics Forum | Wed Sep 02 16:05:20 EDT 1998 | Dave F
| | | | We�ve been thinking again and need your help in sorting through an issue related to deionized (DI) water cleaning of assembled boards. | | | | THE BACKGROUND: The water reclaiming systems goes: gross filter, fine filter, carbon bed, mixed r
Electronics Forum | Fri May 29 17:19:54 EDT 1998 | Earl Moon
| | | | Thanks Steve- | | Here is the whole story: | | | | The solder balls are appearing all over, similar to a | | splatter. They are relatively small. We are using H-Technologies | | S-HQ no-clean solder paste. The stencil is 6 mil and the
Electronics Forum | Mon Jun 01 14:35:59 EDT 1998 | Rich
| | | | | | Thanks Steve- | | | Here is the whole story: | | | | | | The solder balls are appearing all over, similar to a | | | splatter. They are relatively small. We are using H-Technologies | | | S-HQ no-clean solder paste. The stencil is
Electronics Forum | Wed Apr 15 15:04:18 EDT 1998 | D. Lange
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
Electronics Forum | Wed Apr 15 14:57:20 EDT 1998 | D. Lange
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
Electronics Forum | Wed Apr 15 14:53:06 EDT 1998 | D. Lange
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
Electronics Forum | Mon Apr 13 08:47:09 EDT 1998 | Bob Silveri
| | | | | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no
