Electronics Forum | Tue Mar 08 11:50:55 EST 2011 | pgoodyear
As a technician that does frequent board level repair / rework some issues have come to mind. I have been an electronics technician for almost 50 years. In that time I have seen the evolution of electronics from point to point wiring using vacuum
Electronics Forum | Fri Sep 09 18:19:25 EDT 2011 | cusackmusic
First of all, if you are going to tell me to throw my crappy equipment away, and buy a better oven because 3 zones isn't enough for lead free soldering, please find another thread to troll in. We have been using a Hotflow 3 for several years for lea
Electronics Forum | Fri Jul 21 09:23:05 EDT 2017 | sumote
I am not going to give you any names of equipment manufacturers as I believe most people tend to recommend only what they are familiar with. I have my favorites as, likely, most everyone else does as well. What I will tell you is equally important.
Electronics Forum | Thu Feb 10 15:26:57 EST 2000 | Dean
Simplify. FInd your botle-neck process (use a stop watch). You assume it is a P&P machine...(it could also be print or glue etc.) Your only concern is that bottle neck process and how many parts / hour that process can deliver. That is your gatin
Electronics Forum | Thu Feb 10 13:01:29 EST 2000 | Wolfgang Busko
Hi Russ, yes, I did get the homeplate info, thanks. Thought that it looks that way, only didn�t know how to deal with that expression. Now your problem: it�s hard to tell without seeing it actually. All I wonder is this 80sec above liquidous, at what
Electronics Forum | Wed Feb 09 16:09:06 EST 2000 | Doug
Does anyone have any ideas on setting up a parts library/database on an SMT line? We would like to identify a particular part by it's package style, instead of by the customer's part number, in order to reduce the amount of entries in the library.
Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette
John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th
Electronics Forum | Wed Dec 13 11:11:20 EST 2000 | CAL
CONFUSED???? The the "BIG-chip-in-the-middle" on my image is IC732. IC304 is the 52pin QFP to the right of the "BIG-chip-in-the-middle".If it worked when the "Thingy" was there and does not work when the "thingy" is not there good indications are you
Electronics Forum | Sun Feb 23 14:32:42 EST 2003 | davef
Sources of sulphur in PCB fabrication are: * Some locales have high H2S concentrations in the air. * Metal etching steps that use sulfuric acid or a sulfonated buffering compound may result in sulfate residues. * Sulfates can come from contact with
Electronics Forum | Fri Dec 01 14:12:50 EST 2000 | Jim M.
My company currently uses water soluble paste for our SMT process. We were having trouble retaining hot water in our in line, closed loop DI cleaner. The cleaner kept shutting down when the water temp. dropped below 125C. As a result, the conveyor
