Electronics Forum: soldered (Page 740 of 2099)

Rework solder fountain in lead-free

Electronics Forum | Mon Jun 23 12:50:49 EDT 2003 | russ

There are coatings available for Stainless that will greatly retard the solder from wetting to/eating the metal. This may be a cheaper route to go than Using all Titanium. The coating is melonite QPQ (quench-polish-quench)I really don't have any mo

ultra sonic cleaning

Electronics Forum | Wed Jul 02 03:12:31 EDT 2003 | Joanna

We have been having problems with solder paste balls around fine pitch ICs and have decided that cleaning the boards in an ultra sonic cleaner may reomove these solder balls. However we are worried that the ultrasonic cleaning process may damage the

Routing Under Chips

Electronics Forum | Thu Jul 03 15:29:46 EDT 2003 | bpan

Hello Jim, We build boards that have traces under the parts all the time. For the most part, we have no problems but on one product we have an 0805 that bridges 2 traces with a very tight seperation and if any solder smears (under the part)we can and

Bga replacement on ENIG Fabs.

Electronics Forum | Tue Jul 29 09:28:24 EDT 2003 | russ

Why would you get black pad from rework? I could be wrong but once the pad has accepted solder from the first reflow process wouldn't that eliminate the possibility of a latent finish defect? I am curious. We do perform rework on ENIG all of the tim

Wave Soldering Upflow

Electronics Forum | Tue Aug 05 12:56:54 EDT 2003 | caldon

Hi matt- You describe the board but did not indicate the components being inserted (even there is a part being inserted). Assuming your hole dimensions are ok... Are you cutting and clinching the parts? If so what is you clinch angle? We to have mu

Wave Soldering Upflow

Electronics Forum | Tue Aug 05 17:19:55 EDT 2003 | csimfgeng

Another variable is whether the ground pads have proper thermal reliefs. If the pad has solid ground plane around the perimeter, the heat being applied will quickly dissipate to the surrounding metal. A proper relief of the pad will prevent the hea

SMT gold plated components

Electronics Forum | Wed Aug 06 16:35:31 EDT 2003 | Carol

This is an old topic, but keeps coming up. Solderability and reliability issues with SMT gold plated terminations when used with tin/lead solder paste/hassle finish PWB. I need to know which standard (mil, IPC, J-STD??) tells you all about the probl

Soldering Lead-Free Components with Leaded Paste

Electronics Forum | Thu Aug 07 15:41:12 EDT 2003 | gdstanton

To further clarify my question. I'm dealing with mixed solder technologies on a single assembly and am curious how the rest of you guys handle this. Do you use lead based reflow profiles or revert to lead free based profiles? If you haven't seen t

Pb Free Components and Non-Pb Free Solder

Electronics Forum | Mon Aug 11 15:57:18 EDT 2003 | Fred Matthews

As the traqnsistion to Pb free manufacturing gains speed and exposure the period between true Pb free solutions and the present is still somewhat distant. Are there any publications or documentation on the use of Pb free components and non-Pb free

lets see a show of hands

Electronics Forum | Thu Aug 14 09:34:46 EDT 2003 | davef

We can solder and clean lead-free in well-controlled and stable processes. We have no reason to believe that products made with lead-free will be reliabile. We know that lead-free soldering is worse for the environment than other less costly proces


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