Electronics Forum | Tue Jun 19 19:03:31 EDT 2007 | diesel_1t
Hi folks. If the solder is on the BGA but is not soldered at all on the pads, then you can discard BGA solder issues, by the other hand; you might be experiencing wicking due to heat is being absorbed on component so the balls on BGA are hotter than
Electronics Forum | Tue Mar 02 10:24:06 EST 2004 | russ
I have done this before, We print with a 5-6mil stencil and have had no problems with any underneath solder. If you are still nervous instead of removing from stencil use some 3 mil kapton tape or equivelant and tape off the BGA pads. This way the
Electronics Forum | Thu Dec 07 20:28:07 EST 2006 | davef
When rushing to get a job done, it's easy to accidently remove solder mask from a nearby via when dressing BGA pads after removing the part. Just hit the via with some super glue [then say a small prayer] and push on. As an alternative, look here:
Electronics Forum | Tue Feb 11 13:12:25 EST 2003 | Jim Mills
Use a PCB fab house that is capable of "Conductive Via Filling" is the way to do it right. A conductive epoxy is used to fill the drilled via PRIOR to final plating. After final plating, the surface of the "Filled Via" will appear to be the same as t
Electronics Forum | Thu Feb 16 05:49:28 EST 2017 | endruw18
Hello everyone.Ihave an Intel 855pm Northbridge and when i removed the chip,i lifted 4 pads one of them is VSS so i dont care it but the 3 other is:HI 4 ,HI8 and HI 6 (hub interface for cmos i/o or simply hub interface ).Are the vital or only testing
Electronics Forum | Wed Sep 21 16:25:43 EDT 2005 | GS
IPC-7525 tells you how to make stencil apertures for BGA IPC-7095 tells you how much should be the paste volume in order to get a reliable BGA solder joint. How are your PCB finisced? (HASL, ENIG, OSP, etc?) In case of not HASL, it could be necessa
Electronics Forum | Tue May 20 17:09:13 EDT 2008 | davef
Sorry, we didn't do a good job of understanding your question. For more on delamination, look here: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=54655 ... but we're not so sure that this is a straight delamination issue, because: * One
Electronics Forum | Fri Jun 05 16:06:51 EDT 2009 | mjz289
This is from a section of an ALtera EP2SGX130-5 STRATIX 2 leadfree 1,508 ball BGA. What can be causing this? It is from an unused board (not assembled in a unit, or in the field, but it did pass electrical and function test. There are three of them i
Electronics Forum | Tue Jun 20 22:52:10 EDT 2006 | davef
We all know those academic 'reliability studies' are very focused and only give a snapshot of real life. The real reliability studies of leadfree are starting as we scramble to meet our numbers. We have no idea about your customers' expectations ab
Electronics Forum | Mon Aug 11 10:37:19 EDT 2008 | realchunks
I assume you mean the balls of the BGA, not pads (laugh it up guys - I said balls). If so, you may have a no-lead BGA or a high temp BGA.
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