Electronics Forum: lead-free solder paste (Page 744 of 806)

Re: Yo! Who's got a decent used Airvac/Solder fountain for sale?

Electronics Forum | Tue Sep 01 23:21:36 EDT 1998 | MIKE

| Hey there ya'll!! | I went and looked at the used equipment page here, and I've also looked around at a few other sites to try and find me a used PTH dynamic solder pot...like a Airvac type of unit. It doesn't have to be as fancy as a Airvac, j

Re: Gold boards OK with SMT?

Electronics Forum | Thu Aug 06 17:25:55 EDT 1998 | Earl Moon

| Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not ele

Re: Drying ICs any advice

Electronics Forum | Fri May 15 14:41:25 EDT 1998 | Terry Burnette 512-933-5783

| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |

Re: Water Soluable Flux for Military

Electronics Forum | Wed Apr 08 13:46:22 EDT 1998 | Scott Cook

| Sylvia, | I believe you will find that contrary to Scott Cooks submission, that the work carried out by Robert Clark of Hughes Missile Systems at (then) Tuscon Arizona formed the basis of the MIL-F-14256 spec which "Qualified?" or at least "Approve

Wave Soldering Ceramic PCB's

Electronics Forum | Thu Aug 09 16:41:12 EDT 2001 | johnw

Dave , you know it's your cheery disposoition I love.... Ok so the process: Process is Double sided reflow for SMT & PTH via the wave. Like I said or did I, I forget and can't check back...it's a spray fluxer with noclean mutlicore NR3s-06 water b

The glue with the holes...

Electronics Forum | Tue Oct 16 07:00:06 EDT 2001 | genglish

Hi all, I have a problem and would gratefully take on suggestions, firstly let me explain the situation: We are currently screen printing adhesive, using a method similar to DEKs 'Pump Print', The adhesive we are currently using is supplied from Alp

intro to 2 sided assembly

Electronics Forum | Sat Dec 01 09:09:24 EST 2001 | davef

Sounds like a perfect place to start. Sure we all have different perceptions of fun, don't we? Trial by fire, eh? ;-) A prediction: Your cost accountants are going to freak when they compare the production costs for this board to the more famili

non-wetting

Electronics Forum | Tue May 21 06:33:37 EDT 2002 | hayashi

*the other components are 0402 and SOIC 16, the > solderability were good. *the protection on the > terminations of microleadframe package is > Cu(copper),somebody call that leadless leadframe > package(LLP). *the time above 210 deg C is about

SMT Component Design Requirements

Electronics Forum | Fri Oct 18 17:04:38 EDT 2002 | ereno

We have a connector mfg that claims that their design is good and does not contribute to the problem that we are having. The problem is evidence of poor soldering. All other components that surround this connector have very good solder joints, with t

Help! BGA Socket / BGA Direct Placement

Electronics Forum | Mon Nov 11 17:32:50 EST 2002 | dphilbrick

We have a tidy clause in our contract where as we are not responsible for functionality of prototypes. With that in mind we do what ever the customer is willing to pay for! Experiment away my boy! Now for my two centavos on your question. Without s


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