Electronics Forum: past (Page 744 of 989)

Damaged PCB.. what do you think?

Electronics Forum | Wed Apr 04 13:50:19 EDT 2012 | rway

This is more a cosmetic issue than anything else. Is this production or an RMA? If it's an RMA, did the customer send it in like this or was it damaged at your facility. If the customer sent it in, I would make an attempt to fix it. I have used s

Tin Mitigation Processes

Electronics Forum | Mon Apr 30 18:34:35 EDT 2012 | hegemon

Pure Tin terminations can be mitigated for components with solder terminations less than .030" in height from the PCB, by using 6 mil stencil with Sn63/pb37 solder paste. That's the simple story for our customers that require it. Beyond that height w

SMD LEDs stick to nozzle while mounting

Electronics Forum | Wed May 23 20:17:48 EDT 2012 | kahrpr

That not such a crazy idea. In a past life a long time ago we had a part sticking issue. some one suggested mold release on the nozzle. ( we also did injection molding) and it did work. It did not appear to leave any residue. We also use a cree Led o

Adding new line

Electronics Forum | Thu Jun 07 12:00:19 EDT 2012 | gnus

We've had similar issues in the past when we were running a My19 and a My12. What we decided to do in the end was allocate just enough parts needed for the first job (taking into consideration reject rate) so when another job comes around needing tha

Inline wash foam

Electronics Forum | Mon Jul 02 18:40:33 EDT 2012 | joeherz

We used to have a Nuclean 324 that was running closed loop with a DI water recirc system. We also had problems with foaming that was solved with a relatively simple fix. We bypassed the final rinse solenoid so that it was always running. This allo

QFN aligment issues

Electronics Forum | Mon Jul 02 14:29:41 EDT 2012 | markhoch

I disagree with the statement that using pads as fiducials shouldn't be a problem. If he's using pads on the PCB, than he is most likely using corresponding apertures on the stencil. During production, these apertures will start to have paste accumul

QFN aligment issues

Electronics Forum | Thu Jul 05 15:33:12 EDT 2012 | dmiller

That's a long board! Based on your description, it sounds like board stretch may be your issue. Look at where the paste is printed on the board. If you have board stretch, you'll see the print off to the left on the left side of the board and off

Expected First Pass Yield for selective soldering

Electronics Forum | Fri Jun 29 12:47:25 EDT 2012 | deanm

We are experiencing widely varying First Pass Yields for selective soldering. Some boards are near 100% while others are less than 50% depending on the pitch and general complexity of the board. Question: If you are running 100 boards through your s

SPI for 32 x 22 Backplane

Electronics Forum | Mon Jul 16 12:19:00 EDT 2012 | jorge_quijano

Does anyone have experience with very large PCBs at Solder Paste inpection? our largest board is 32" x 22", it is a 0.250" thick and I was wondering if there is an Inline SPI for such dimensions. Currently I have a benchtop height measurement device

component stick at cover tape

Electronics Forum | Sat Aug 18 23:03:07 EDT 2012 | eadthem

We have had this problem in the past, On paper tape resistors(old stock from before i took over and forced rotation on everything) and on embossed (national semi parts, strings of glue pulled back like seat belts across the pocket.) For the national


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