Electronics Forum | Fri Jul 22 13:17:49 EDT 2011 | ehughes
I would be careful with trying Rain-X. Rain-X is a silanol treatment that is not durable. That is why you need to reapply it on a windshield many times. Also you could contaminate the paste as it will come off the stencil during the printing. From
Electronics Forum | Fri Jun 24 15:04:22 EDT 2011 | kahrpr
I am going to open the flood gates of comments. The purpose of no clean is so you do not have to clean it. Yes I am aware of no cleans that you can clean. If you need to clean the boards use a water soluble paste. If you do not clean, no clean prop
Electronics Forum | Thu Jul 28 07:23:24 EDT 2011 | scottp
My group supports a couple hundred lines all over the world. Most of them use squeegees but a few use either the MPM Rheometric pump heads or the DEK Proflow heads. I absolutely hate the enclosed heads. Flux separation, compaction, and the print q
Electronics Forum | Wed Aug 03 10:56:47 EDT 2011 | cyber_wolf
We have a new MPM Momentum. It's hands down the best printer we have ever worked with. Load program--add paste---forget about it. Runs every day all day with no issues what so ever. I come from a "machine background" and the MPM's are much more robus
Electronics Forum | Thu Aug 25 21:26:27 EDT 2011 | leadthree
Solderability could be an issue. We usually buy the IC and stock it for up to 9 month. This time the ICs was from a broker and the datecode was not the latest. This said, we use already a solder paste that contains watersoluble flux, which is suppos
Electronics Forum | Tue Aug 23 12:58:16 EDT 2011 | emeto
Hello everyone, we are contract manufacturer and I am wondering if we can save some time from inspection and verification. We will usually inspect the bare boards, then, verify program to BOM, then feeders to BOM and Feeders to program,then paste ins
Electronics Forum | Mon Aug 29 21:36:39 EDT 2011 | davef
We agree with JAX. Changing the pads on your board as you describe won't do shit. Possible solutions to a cold solder connection problem include: * Raise the peak temperature to be high enough to reflow the material thoroughly. * Select a solder pas
Electronics Forum | Thu Sep 22 14:25:13 EDT 2011 | hegemon
Dave has stated the caveats well. I too have similar experience in reworking BGAs that mirrors your own. The only situation where I saw this as an issue, was in memory devices where a row of BGAs might share a commonm heatsink. In those cases the
Electronics Forum | Mon Oct 10 14:03:07 EDT 2011 | adp23
I have a few questions regarding Solder products being UL Listed or Recognized. I am aware that UL does test solder material (conductive material) using the UL 746 standard. However, i would like to know if UL actually recognizes the conductive mater
Electronics Forum | Thu Nov 10 09:25:54 EST 2011 | kevinemslie
We have had an issue where a turnkey company has a solderability issue with boards that we supplied. The most thorough way of proving thay the boards work in my opinion is to take a bare panel randomly from the batch (same date code) to have it paste
