Electronics Forum | Fri Aug 02 12:45:59 EDT 2024 | jdengler
We do much the same as ProcEng1. In the beginning we tried to have them in but this caused a spike in false failures since we attempted to use the same image for all DNI. We quickly figured out that you would end up with many DNI parts in your libr
Electronics Forum | Thu Mar 23 14:17:47 EST 2000 | Finepitch Services
Stuart, My suggestion is a DFM meeting (most of the process people dream about a meeting like this, and luckily, I've been to a few) with: - project manager (if there's one) - customer service rep (annual volume, lot size, product life) - smt proce
Electronics Forum | Wed Feb 23 20:25:17 EST 2000 | Chris Wallace
Like all who post messages here, I'm looking for a little bit (well, maybe a lot of bit) of help. We're currently going through a redesign of a board which will utilize several FPGAs. The manufacturer (Xilinx) recommends using solder mask defined p
Electronics Forum | Thu Feb 17 14:10:37 EST 2000 | C.K.
I'd have to agree with JAX here. This forum is intended to be a "Technical Bulletin / Newsgroup" and nothing else. Truthfully, these posts of the "old-timers" announcing their departures is getting..well.....OLD. I hate to see the Old-timers leave
Electronics Forum | Thu Feb 10 13:54:22 EST 2000 | Kris W
Hi All, We are in the process of converting from RMA solder paste to no-clean process across the shop. This will allow me to carry my semi-aqueous cleaner out of the building and set it ablaze using the terpenes as the fire water. Then I can go ab
Electronics Forum | Fri Feb 11 10:14:54 EST 2000 | C.K.
Dave, to answer your questions, point-by-point: � Just out of curiosity, how are second side, skippy components oriented on the board with respect to the wave? The SMD's are all oriented in the "correct" direction with respect to wave direction(i
Electronics Forum | Tue Dec 26 12:35:09 EST 2000 | Dave F
Your English is fine. Your assessment that corrosion on a portion of the metalization on the end of a component is causing the tombstoning is reasonable. We've seen that before. Corroded components received from a supplier is not acceptable as an
Electronics Forum | Fri Nov 10 10:39:43 EST 2000 | omar_verdugo
Hello Eva. I was using Fujicam 1.1 and i had a problem with the theta is in the shape library for example all the drawings are on 0 degress like a in the part data and all that work fine with the anothers machines like a cp6, but when i use a ip2 i m
Electronics Forum | Wed Jan 17 03:35:07 EST 2001 | Arul
We have few failures similar to the discussion in this thread, on a 50 Mil pitch, 30 Mil mill Ball PBGA. Would like to understand the mechanism of the BGA reflow process bit more. Appreciate your response to the following. 1.We sheared few solder ba
Electronics Forum | Tue Oct 31 03:50:20 EST 2000 | JohnW
Honda, Prnting Glueisn't as difficult as it sounds, as long as you have the right stuff and a good set up. It also depend's on what your going to be placing. If your just doing 0603, 0805 and 1208 than you really only need an 8 thou or 10 thou stenc
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