Electronics Forum | Mon Mar 03 15:44:56 EST 2014 | emeto
with 0.5mm pitch I wouldn't go too fast. Check your separation speed as well as your print area(may be you can drive your squeegees 1-2 inches less). Some pastes like Alpha like very fast separation. so you can win another 2-3 seconds from there.What
Electronics Forum | Thu Mar 27 08:23:37 EDT 2014 | emeto
Hello, we have several generation of Siemens machines and one of our lines is ASM SX1 series. Machine is very accurate and reliable as a hardware, but in my opinion the software is their biggest advantage. Software is very powerful and can do things
Electronics Forum | Thu Apr 17 14:01:26 EDT 2014 | hegemon
And digging a bit further, are the opens at the device level (all the solder on PWB pad, none on device pad) or at the PWB (similar to pillow defect?) After answering that, I would start thinking about(in this order)paste print quality and consisten
Electronics Forum | Mon Apr 14 15:37:00 EDT 2014 | jdenuzzia
If you do a search on Reflow Oven Cleaning Fluid, you will find links to companies and chemicals that can assist you. I recommend that you contact one or more of the companies and discuss your needs and the paste you are using. They should be able t
Electronics Forum | Thu Apr 17 13:37:11 EDT 2014 | anvil1021
Hello All....we have several hundred PCBs that we need to run with a no-clean solder process and the surface finish is OSP. Our preliminary testing has found that the solder will not wet the entire pad even if the pad is over printed? We have contact
Electronics Forum | Fri Apr 18 14:25:51 EDT 2014 | horchak
what is the technology? Is there fine pitch, double sided, number of layers, lead free? If the pcbs are not of the highest quality you may be set up for failure with no clean process. Couple things to look at is your paste flux content versus medal
Electronics Forum | Tue May 13 17:53:54 EDT 2014 | anvil1021
Hello Michel...this might be a bit of a battle finding the low thermal EMF material that you are looking for. The first one that comes to my mind is Bismuth Selenium Telluride, with either a nickel or cobalt doping agent. Silver went away from this
Electronics Forum | Fri May 23 23:45:38 EDT 2014 | edriansyah
Hi Evtimov. 1. yes both part and the process are lead free/RoHS 2. I ever did X-ray, the balls shape are good and I dont see any evident of head in pillow (but my x-ray machine is not too good) Head in pillow was also my first suspect. but after the
Electronics Forum | Fri May 30 20:03:14 EDT 2014 | hegemon
Starting with the manufacturers layout is a good start. Tilted parts, bad solder joints, sounds like a wetting issue and the board or the parts. Insufficient solder sounds like the printing process needs some attention. We have used this part in th
Electronics Forum | Wed Jun 04 21:11:11 EDT 2014 | isd_jwendell
This style gave me grief as well. The problem is the way the part is manufactured leading to an unusual pad configuration. When the part is placed on the PCB there is no pad wrap under the part, the pad is 90 degrees to the board. The datasheet shows
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