Electronics Forum: because (Page 76 of 443)

SPC software use with vision check data

Electronics Forum | Wed Mar 05 13:37:20 EST 2003 | msivigny

Hello James, It sounds like the system that's being used to gather this data is an AOI system. I will investigte this more because I'm very curious of the process in which this works. I'll keep an eye out for someone using this setup and may get back

lead free

Electronics Forum | Wed Mar 05 16:58:40 EST 2003 | msivigny

Hello Kris, No, it's not necessary to have a nitrogen tunnel setup. A nitrogen tunnel allows a process to go the extra step in providing higher quality through less defects. I can't really speculate on it's use in contract manufacturers mainly becaus

IPC Class II and Class III reliability

Electronics Forum | Wed Apr 09 14:09:54 EDT 2003 | davef

MA/NY DDave, I'll take your money. I'm betting on the Class II, whatever that is, because: * Solder is the same. * Board is the same from a fabrication and probably materials standpoint. * Components are the same. * Processing is the same. ... but

Tombstone defect

Electronics Forum | Mon May 05 11:35:00 EDT 2003 | Grant

Hi, This is an interesting point. I use Koki paste from Japan, and it's wonderful, however what properties of solder paste would make it "anti tombstone" paste? How does led free effect tomb-stoning? That would be interesting to know. We might go

Standard kit in LVHM environment

Electronics Forum | Fri May 09 16:48:59 EDT 2003 | Ozzy

KH This won't work if your planning on running these 2 machines together in line. The fast machine will always be waiting on the slow machine. How many Philips FCM's have you seen in line with Mydata? Don't think to hard; the answer is zero. Wh

pretinning

Electronics Forum | Wed Jun 04 09:15:06 EDT 2003 | davef

We used to use 260+-5C (500+-10F) for Sn63, now we use 240-260C (460-480 F). You probably could get away with 232C (450F) in all cases, since there is no thermal mass to a lead being tinned. We keep our tinning temperature the same as our solder po

Reflow Oven Recipes

Electronics Forum | Fri Jun 27 11:33:50 EDT 2003 | James

I am doing the same once I get a few varies in different profiles, I set about 6 different levels and depending on board thickness and qty of large parts I go from that. It has worked well for us. Hope this helps because we also hate waiting for ano

Naming Files

Electronics Forum | Wed Jul 02 17:46:23 EDT 2003 | csimfgeng

WOW! Just when you thought you had seen it all! I follow your logic perfectly and concur. I bet the first time your customer loses a valuable customer because of a file mix-up, they may change their tune. "Doing things the way they have always

lets see a show of hands

Electronics Forum | Wed Aug 13 11:06:01 EDT 2003 | bremerg

I work for a avonics company and the decesion by the company is that we will move over to LF kicking and screaming. They did the same when I took the 1,1,1,Trichlorethene away due to government regulations. Be carefull when any governmental organiz

solderability and hasl thickness

Electronics Forum | Tue Sep 09 18:07:18 EDT 2003 | davef

We would be very wary of allowing 50 uinches, because this will likely result in reduced shelf life due to intermetallic growth. As a guesstimate, at least 10 uinches of that 50 uinches, and maybe more, is already intermetallic when you receive the b


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