Electronics Forum | Wed Feb 05 14:20:45 EST 2003 | Stephen
One thing that worked for me was simply rounding off the pads, making square pads into circlesfor the stencil. It worked but did seem a little strange turning squares into circles for 0603's and 0402's and turning cirlces for BGA's into squares, (bu
Electronics Forum | Wed Feb 05 19:43:34 EST 2003 | iman
If by the Powers Ta Be (customer/designer), you can't change the PCB design, negotiate for the PCB fab house, to block the via holes with their (green?) solder mask some customers/designers want to have via holes to be present in the PCB pad, due to
Electronics Forum | Tue Feb 11 15:54:23 EST 2003 | Jodi Roepsch
I am interested in knowing if anyone has new information about the black pad defect with ENIG plating. I am interested in it from the viewpoint of risk assessment, testing done on final product to isolate failures,and root cause of the defect. Than
Electronics Forum | Tue Mar 11 08:33:31 EST 2003 | davef
SMTA [www.smta.org] New On-line Presentation - March 14 Dealing with the Black Pad Defect in Manufacturing Solectron Vice President of Technology Srinivas Rao And Director of Process Integration Kim Hyland Date: Friday, March 14 Time: 10:30AM - Noon
Electronics Forum | Wed Mar 19 09:59:45 EST 2003 | davef
Jodi What's your thinking on the black pad rework technique proposed in: �A Failure Analysis And Rework Method �� Z. Mei, et al, SMTA International 1999, p407
Electronics Forum | Thu Mar 20 09:50:42 EST 2003 | Jodi Roepsch
We have not found a way to rework boards successfully at this time. Boards with severe black pad get scrapped.
Electronics Forum | Tue Apr 22 05:38:56 EDT 2003 | mk
This sounds like a job for ssd. No pad shapes to worry about. Look into http://www.sipad.net and please contact me off line to discuss it. Matt Kehoe mkehoe@sipad.net
Electronics Forum | Fri Apr 25 08:09:13 EDT 2003 | razor
Thanks for response. I do wish to qualify that I got the alleged role of Nickel use for corrosion resistance from an article authored by Jason Gjesvold, IS IT REALLY BLACK PAD?, "Phosphorus rich Ni alloys are often used for corrosion resistance duri
Electronics Forum | Mon May 05 02:37:11 EDT 2003 | gaoliangcheng
Maybe you can check the thickness of the solder mask between the pads. If the highest of the solder mask exceed the pad,then the component which was placed will be unbalanced.
Electronics Forum | Mon May 05 03:53:41 EDT 2003 | praveen
Do not 'ON" the nitrogen during reflow. If the pad of the chip is bigger then reduce the pad width from out side. Reduce the ramp rate at any point of the profile below 1 deg c/sec.
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