Electronics Forum | Wed Jun 20 13:50:52 EDT 2007 | rgduval
Dominic, I guess it would depend on criticality and volume. We do mostly low volume builds here, and the only time I do a solderability test is when we encounter an issue during production. That process works for us, considering the volume of the
Electronics Forum | Tue Jun 26 11:24:56 EDT 2007 | ck_the_flip
Patrick, Back in my rich OEM days, i actually DID measure mg/in^2. I bought a scale, which measured in mg, specifically for this. Basically, took a blank PCB, took a "before" weight, sprayed it, and then took an "after" weight. I measured at diffe
Electronics Forum | Tue Jun 26 14:28:50 EDT 2007 | bjrap3
I have been trying to rework a lead-free BGA. For some reason, when I remove the BGA the corner pads on the board come off and the board must be scrapped. If I do manage to remove the BGA successfully, when I solder the BGA, the corners of the BGA
Electronics Forum | Tue Jul 10 11:36:22 EDT 2007 | dyoungquist
Hi SMT Frog We are using an upgraded Mydata TP9-1 system to place 0402s. We do an electrical test plus mechanical centering and use the C14 tool. A few things we have observed/learned: 1) Is the machine not picking the part up out of the tape? Po
Electronics Forum | Thu Jul 12 07:52:08 EDT 2007 | cyber_wolf
I agree avalancher. Your description is a valid point. But, I am still under the impression that the vac level is a separate issue. His original problem was 0402's missing off the board ,and weird measurements showing up when parts get rejected. I w
Electronics Forum | Tue Jul 03 10:57:01 EDT 2007 | randomtech
To start, i do not know much about this industry. I am an inventor, and designed an electronic device. I am currently building the prototype myself. I need to find out where i can get this product produced. I would need PCB, component assembly, p
Electronics Forum | Thu Jul 05 19:37:15 EDT 2007 | davef
We assume the three leads are lined-up perpendicular to the wave. Without taking corrective action, we know this: * 50 thou pitch will bridge * DIP do not bridge As a corrective action that doesn't invovle a respin of the board, decrease the solderm
Electronics Forum | Fri Jul 13 19:35:02 EDT 2007 | hegemon
We have had good success doing pb Free QFN work. Typically for the center pad we use ~68% coverage with 1:1 ratio on the perimeter pad. For the 68% coverage we have tried cross hatch pattern, diagonal stripes, dot series, and most successfully a clo
Electronics Forum | Mon Jul 16 12:03:42 EDT 2007 | davef
We're aware of no industy acceptance standard for max moisture content of a board. For more on moisture levels, get a copy of: "Removing Moisture from Electronic Components and Assemblies", CS Leech, Jr, Circuits Assembly, May 1994. The article disc
Electronics Forum | Tue Jul 10 03:51:49 EDT 2007 | vangogh
Hi All, We are producing PCBA with COB process. We are using kapton tape to protect the COB pads from solder splashes/stains. Questions: 1) Is kapton tape an industry accepted way of protecting gold pads from solder splashes? 2) What are the chance
