Electronics Forum | Mon May 05 02:37:11 EDT 2003 | gaoliangcheng
Maybe you can check the thickness of the solder mask between the pads. If the highest of the solder mask exceed the pad,then the component which was placed will be unbalanced.
Electronics Forum | Mon May 05 03:53:41 EDT 2003 | praveen
Do not 'ON" the nitrogen during reflow. If the pad of the chip is bigger then reduce the pad width from out side. Reduce the ramp rate at any point of the profile below 1 deg c/sec.
Electronics Forum | Mon May 05 03:53:47 EDT 2003 | praveen
Do not 'ON" the nitrogen during reflow. If the pad of the chip is bigger then reduce the pad width from out side. Reduce the ramp rate at any point of the profile below 1 deg c/sec.
Electronics Forum | Mon Jun 02 11:01:19 EDT 2003 | emeto
Hi All, I am looking for some standart for pad and component dimencions. Is there anything more accurate than 30% and if so who works with it? Which libraries are based on some standart? Is there a catalog I can read or something in electronic format
Electronics Forum | Tue Jun 03 08:15:10 EDT 2003 | davef
On pad design, look here: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=18036 On component sizes, look here: http://www.practicalcomponents.com
Electronics Forum | Wed Jul 09 15:56:14 EDT 2003 | Matt Kehoe
Hi Dave, Hmmm, pix F2? Do you meran figure 2 or second picture? The second picture is the bare board before printing. Gold plated pads. Is that what you mean? mk
Electronics Forum | Wed Jul 09 16:12:01 EDT 2003 | Matt Kehoe
Right-o Dave, Thats the 2 lifted pads turned upside down so actually you are looking at the bottom of the base copper where it used to be attached to the laminate. mk
Electronics Forum | Thu Jul 17 10:56:50 EDT 2003 | James
COULD SOMEONE PLEASE TELL ME OF A WAY TO CLEAN THE OXIDIZATION OF OF WHITE TIN PADS, I AM GETTING ALOT OF DEWETTING PROBLEMS. AND I CONCLUDED THAT ALL THE BOARDS WITH WHITE TIN ARE HAVING THE SAME PROBLEMS. THANKS FOR THE INPUT.
Electronics Forum | Thu Jul 17 12:08:56 EDT 2003 | russ
The only way I have been able to do it so far is to apply a very agressive flux and then wave the board and then wick all of the pads. (Totaly S#$KS). I trust you will eliminate this finish in the future? I hate tin for this reason. Russ
Electronics Forum | Thu Aug 21 12:31:54 EDT 2003 | adlsmt
I have some finished boards that I have concluded have "black pad" defect. Outside of the black crap on some of the solder joints, if the boards are electrically functional, are they reliable? Any opinions would be appreciated as I dont want to throw
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