Electronics Forum | Wed Aug 04 21:52:54 EDT 1999 | Dave F
| We're getting field failures in a high impedance portion of the circuit. Think the unpopulated pc card has contaminates because we were able to grow dendrites by applying a 9 volt battery across the suspected pad, placed a drop of de-ionized water
Electronics Forum | Fri May 21 15:23:24 EDT 1999 | JohnW
| | Has anyone had any experience or data using vibration during the reflow process. | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process work
Electronics Forum | Tue Mar 16 14:05:04 EST 1999 | Steve Skinner
| Does anyone have any recommendations on spray fluxers? Are there major differences between the high priced ultrasonic machines to the low priced flux/air spraying machines? We are going to be spraying an OA flux with 11% solids content. Are there a
Electronics Forum | Wed Feb 10 00:07:15 EST 1999 | Jason
Gary, I am also evaluating MRP/ERP systems. I have had many demos. I have looked at SAP R3, and actually used it at a previous employer, very complex system and a bit pricey. SAP is at http://www.sap.com , others I have looked at are Acacia Tech
Electronics Forum | Fri Feb 05 12:50:06 EST 1999 | Steve Gregory
| Love the picture. | | We are considering the PRC 1500. It combines a thermoflo unit with a MBT 250A which we currently use. Does anyone know the difference between the TF200 and the TF700? This is the first I have seen the TF700 mentioned. | |
Electronics Forum | Tue Feb 02 09:47:45 EST 1999 | Justin Medernach
| Hi everybody. | Somebody know any consideration or special care to make a profile for BGA's. | | any advice is aprecied. | | thanks | Al Carrillo | | Hi Al, A BGA should be looked at just like any other surface mount device. However, just
Electronics Forum | Tue Feb 02 17:51:45 EST 1999 | gcollier
| | Hi everybody. | | Somebody know any consideration or special care to make a profile for BGA's. | | | | any advice is aprecied. | | | | thanks | | Al Carrillo | | | | | Hi Al, | A BGA should be looked at just like any other surface mount d
Electronics Forum | Mon Jan 25 20:53:03 EST 1999 | Earl Moon
| Greetings, | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | Also, is there any danger of the pcb's giving off some kind of gas or vapour which can b
Electronics Forum | Thu Dec 24 01:38:36 EST 1998 | Chris Grendler
I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. My current 0402 chip pad sizes on alumina and FR4 substrates are .022"X.
Electronics Forum | Wed Oct 21 09:43:40 EDT 1998 | Stefan Witte
You'll not find any solvent, which removes cured epoxy and not attack the board material as well. If there are traces underneath the surface mount components even mechanical removal of the epoxy may mess up your boards. As a mechanical tool I recomme
