Electronics Forum | Mon Jan 27 12:27:03 EST 2003 | ksfacinelli
We have an assembly that requires a number of high density connectors to be placed after SMD. The process will not allow a normal wave solder setup due to the population of SMD comps. We cannot use a selective solder pallet due to profiles. We are
Electronics Forum | Mon Jan 27 14:16:46 EST 2003 | russ
i have done this thousands of times. You are correct about no preheat, however it never seemed to be any issue for us. You do have to make sure that you do not expose any SMT comps. to the solder or they will become heat stressed/fractured. Connec
Electronics Forum | Wed Feb 05 17:37:40 EST 2003 | mk
Investigate "Solid Solder Deposition"
Electronics Forum | Fri Feb 14 22:03:40 EST 2003 | caldon
Air liquide has some great articles on this www.airliquide.com Cal
Electronics Forum | Tue Feb 25 10:32:09 EST 2003 | davef
I don't know the precise scheme, but it goes something like this ... WHAT TO DO * Use the general work instruction that applies to all boards. It goes into dimension and hole checking processes. It talks to visual instection of solder mask, solder
Electronics Forum | Fri Mar 07 14:46:16 EST 2003 | caldon
Technical Devices Also has a nice machine. Please goto www.technicaldev.com
Electronics Forum | Mon Oct 11 15:23:03 EDT 2004 | Phil
Hi Kevin Please also see my website http://www.solderrecovery.com
Electronics Forum | Tue Mar 11 09:49:59 EST 2003 | MGARCIA
DO YOU KNOW? WHAT KIND OF SOLDER PASTE IS BETTER IN ORDER TO AVOID THE TOMBSTONE DEFECT IN SMT PROCESS.
Electronics Forum | Tue Mar 11 10:19:00 EST 2003 | yngwie
We ran doublesided SMT thru Glue and Wave process before and but faced a lot of skip solder. Then the customer told us that they have similar problem when they ran the board so what they did was they print the paste-dispense the glue- place the comp
Electronics Forum | Wed Apr 02 09:25:32 EST 2003 | davef
RDR The most common cause of dewetting is from a fabricator using any form of abrasive (e.g. pumice, abrasive brushes etc.) on copper. With this process, abrasive particles get implanted into the copper (often actually swaging copper over some of th
