Electronics Forum | Mon Aug 14 20:37:03 EDT 2006 | davef
JEDEC defines packaging, matrix trays, tape and reel, and like whatnot. You need to be searching ANSI and IPC. Find these documents: * ANSI/J-STD-020, Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices *
Electronics Forum | Mon Aug 21 04:36:34 EDT 2006 | Rob
Yes, appropriate storage & component handling proceedures should be followed depending on the MSL (Moisture Sensitivity Level) class of the component. Some component suppliers are now marking the MSL class on the label, along with PBT (Peak Body
Electronics Forum | Tue Oct 24 09:35:33 EDT 2006 | jax
The need to Pre-Bake depends on multiple variables: 1. Packaging from the vendor (dry packs, vacuum sealed, etc...) 2. Storage at your facility (temp, humidity, etc...) 3. Moisture absortion rate of Laminate (FR406BC is one of the highest) Other rea
Electronics Forum | Sun Oct 29 22:41:29 EST 2006 | hanocete
We have a current problem on our packages after we bake it for 24 hrs prior BGA rework. Flux or white residues found on the connector leads and terminals that cause not contact problems during mating. Could you help us how to clean the fluxes properl
Electronics Forum | Mon Oct 30 21:43:08 EST 2006 | davef
So, after the repair of a BGA, you notice white reside on a nearby connector. Correct? [Sorry we're so dense. Long day.] Tell us about: * Flux class used in repair * Flux class used in original assembly Why are you baking the assembly after repair
Electronics Forum | Fri Nov 17 08:04:24 EST 2006 | jdumont
Morning all. I was wondering if there is a packaging standard (other than 033B) that we can put on our POs to vendors. We are seeing a lot of MSD components come in packaged incorrectly and do not have the man power to bake everything before it goes
Electronics Forum | Wed Jan 03 16:52:19 EST 2007 | Pete
What is a foolproof means of eliminating moisture content from Printed Circuits that arrive (bot hpurchased and consigned) in unsealed, non-dessicant packed bags? Als, is there a procedure for basic mass of boards vs. temp/cure times? I need to min
Electronics Forum | Wed Feb 21 21:01:57 EST 2007 | davef
Yes. Heat reduces OSP solderability protection thickness. For instance, many OSP are shot at the end of the first reflow pass and the exposed copper is free to oxidize. If you're speedy, you can pull-off the second reflow cycle before the copper g
Electronics Forum | Mon Jan 08 03:16:12 EST 2007 | oswald5087
hi' i need advise on immersion gold PCb shelf life. 1) what is the issue shelf life or expire for Immersion gold PCB? 2) How long we can keep the PCB? (with vacuum seal and without vacuum seal) 2) iF PCB expire, can we bake the immersion PCB? what t
Electronics Forum | Wed Jan 17 07:55:11 EST 2007 | pavel_murtishev
Vladimir, Phil J is right. Tantalum�s moisture vapor outgassing is the root of the problem you are searching for. Internal pressure of entrapped moisture becomes very high in reflow zone. Vapor jet shifts your components and affects BGA�s bumps. Bak
