Electronics Forum | Wed Jul 12 21:43:20 EDT 2000 | Dave F
Hey Jack: What is it with you and the IPC?? ;-) Can use the IPC documents that the IEC "xeroxed" and republished? ;-) Consider: � Vern Solberg is teaching a two day course titled "Printed Circuit Board Design For Surface Mount Technology" at Uni
Electronics Forum | Wed Jun 14 12:43:52 EDT 2000 | Todd Murphy
Dave, you are right you would expect the soldermask to be higher than all SMT pads on the pcb if it is higher on the fine pitch components, but the other areas of the board do not concern me as much as the fine pitch areas. The pads on all the other
Electronics Forum | Tue May 23 09:21:48 EDT 2000 | Brett W. Philipp
I am a PCB Designer / Mech. Engineer for a telecom company that has just started. What I would like, if possible is a reference copy of the SM-782A IPC spec. or some input on a way to calculate depending on the PLCC part dimensions, land pattern crea
Electronics Forum | Tue May 23 10:42:37 EDT 2000 | Wolfgang Busko
Hi Brett, we like designer who care about pad design, welcome on board. Go to the IPC-homepage under www.ipc.org. There you find the information how to order IPC-documents, you don�t have to be a member to get them. Also you can find an online landp
Electronics Forum | Mon May 15 20:10:27 EDT 2000 | Dave F
David: How about starting with MCMs? IPC docs are: * 2225 - Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies * DD-135 - Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip
Electronics Forum | Mon Jan 22 20:54:55 EST 2001 | davef
IPC-7095 - Design & Assembly Process Implementation for BGA's Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. This document
Electronics Forum | Tue Jan 30 12:03:15 EST 2001 | slthomas
Pete, I'm wondering how much optimisation you needed (or were allowed) to do with respect to connector design. The first one we evaluated had a row of leads that I can only describe as "crescent" shaped in cross section. Impossible to get even 50%
Electronics Forum | Tue Apr 10 10:10:03 EDT 2001 | Rob Fischer
Obviously the less mass in the wave the better. There will be less heat sinking and less push on the solder. Pallet thickness is typically a function of the tallest component on the board. If the board has one component that is tall but small in a
Electronics Forum | Mon Apr 16 10:01:43 EDT 2001 | onset
Please help, Engineering has come to me with a crazy idea of putting vias straight through 0805 pads due to limited board space. I was wondering if this has ever been attempted by anyone and if it works. I'm assuming it will have negative affe
Electronics Forum | Fri May 04 18:27:34 EDT 2001 | chpark
BGA warpage combined with PCB warpage can lead significant process yield loss. First, it is possible that major portion of BGA's apparent warpage is, in fact, coming from the PCB warpage. Assuming that the warpage is solely from BGA itself, I think
