Electronics Forum | Tue Jul 28 09:15:49 EDT 1998 | Justin Medernach
| We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ============= | 1) 16 layer (4 power, 4 gnd, 8 signal) | 2) gold on nickel finish | 3) ceramic BGA with eutec
Electronics Forum | Fri Jul 24 12:12:52 EDT 1998 | smd
200 boards/Hr and oven will reflow ~180 boards/Hr but the P&P machine will only place 700-950 CPH | | when setup is taken into account. Minimum pitch is normally .020" and we place an Avg. of 491 TSSOPs and 217 BGAs a month. | | We don't even bother
Electronics Forum | Fri Jul 24 16:02:13 EDT 1998 | Justin Medernach
200 boards/Hr and oven will reflow ~180 boards/Hr but the P&P machine will only place 700-950 CPH | | | when setup is taken into account. Minimum pitch is normally .020" and we place an Avg. of 491 TSSOPs and 217 BGAs a month. | | | We don't even bo
Electronics Forum | Wed Jun 24 13:46:41 EDT 1998 | Chris Kelly
Brian, a couple of things really stick out here... 1) You are spraying what is referred to here at the CATT as "PINK DEATH" The 3355-11 is about the most active/aggressive flux you can get your hands on. I am concerned about both the condition
Electronics Forum | Fri Apr 10 20:35:59 EDT 1998 | Steve Gregory
| | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. T
Electronics Forum | Mon Apr 13 08:42:32 EDT 1998 | Bob Silveri
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
Electronics Forum | Wed Jan 14 14:36:29 EST 1998 | Mike Cox
Your questions would require volumes of information to answer completely. This is a readers digest version to help you get started volumes Don't rely on inspection as a process indicator of your quality and defect levels. Unfortunately Inspectio
Electronics Forum | Tue Jan 08 17:33:26 EST 2002 | davef
You didn�t identify the type of tape you use, but Kapton or similar tape is not an effective method for attaching thermocouples. Search the fine SMTnet Archives for alternatives and comparison of methods. Two methods for mechanically attaching ther
Electronics Forum | Thu Jun 07 16:33:15 EDT 2007 | mumtaz
Please, it does not matter the school from which it is you came, but what you learned from it that counts. It is simple mathematics my friends. Lets make things simple, shall we not? E=I/R..... this we all should know. We can use this to measure
Electronics Forum | Tue Dec 04 08:34:07 EST 2007 | davef
We no advice to give you on the topic, but maybe while you're waiting for others to reply, reading a trade journal article on the topic might help. Below is a link to "Pin-in-hole reflow (PIHR) and lead-free solder joints" by David Bernard, Bob Willi
