Electronics Forum | Fri May 20 15:00:50 EDT 2005 | russ
So I guess we could repair with the 63/37 until 7/06 then. We should be able to facilitate and figure out easy/ cost effective repair by then I hope. Senior Tech - I don't know who I am talking about when I say "we", lets ask Dave again, maybe he k
Electronics Forum | Mon May 23 23:21:18 EDT 2005 | magkel
HI guys, I am new to this forum, Earlier author is asking regarding of Lead free rework. 63-37 is non lead free and this will contaminate the product itself. I do not know what are the components that you are facing to rework with. But try to set th
Electronics Forum | Thu Jun 02 11:16:23 EDT 2005 | JH
I concern about the Through Hole soldering as well. Currently, we have encountered some problems of Multilayer from Through Hole soldering. The root-cause is probably related to PCB Finish, machine setting, Thermal relief Pad or hole and something e
Electronics Forum | Mon May 30 03:13:49 EDT 2005 | Joris Groot Koerkamp
Hi rob, We use the component for a long time and never had a problem with the reflow process. Since the component is Leadfree we see the problems. We have the same problem with defferent pcb's. The tin not always flows to the same direction. I check
Electronics Forum | Tue May 31 21:39:46 EDT 2005 | davef
We not sure what your supplier means either. So, maybe it's worth a follow-up call. One possibility is: The HASL could be lead-free as easily as it could be SnPb. You probably need to think about how you're going to change your reflow recipe to in
Electronics Forum | Sat Jun 11 07:24:26 EDT 2005 | buchi79
Russ, Thanks.By the way, i already look into the reflow profile & paste storage & thowing requirement. Even i cut down the stencil life to 4 hr to avoid any moisture absorbtion. If i were to change the paste formulation, what would you propose ? But
Electronics Forum | Mon Jun 13 04:26:00 EDT 2005 | Joris Groot koerkamp
For the lead free reflow process we tested with our Vitronics 500smr oven. To reach the high temperature of the lead free profile was no problem. We are not using an active cooling system so the pcb's are maby to hot wen the leaving the oven. Can an
Electronics Forum | Mon Jul 18 13:34:31 EDT 2005 | jzaccari
Francisco, You need to be concerned about "lead-free" BGAs. The SAC balls will not reflow at at standard tin-lead process temps. I have seen many examples where this has been a very big problem. In once case the BGAs just poped-off when the board was
Electronics Forum | Tue Jul 19 08:51:29 EDT 2005 | GS
any thanks Rob, te specimen label Anglia is some thing complete and very helpful example. Hope Comp Suppliers will take care about the needs of Users (mainly if they are small EMS). To know how the terminals/leads are metal finisched is important f
Electronics Forum | Fri Jul 08 18:41:50 EDT 2005 | GS
2 micromillimeters have been "eaten" reducing so the amount of copper thikness. I know they are going to test also HASL by using SACX307. It will be good to know if some one already made HASL tests by using SN100C (N-Superior) Many Thanks GS
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