Electronics Forum | Mon Oct 06 04:03:39 EDT 2003 | iman
Does the EIA standard recommend any standard PCB pad sizes (LxB)? and pitch-to-pitch (Pad) distances? Thanks for the advise.
Electronics Forum | Wed Feb 11 16:47:31 EST 2004 | Jim Hampshire
We are looking for industry input on solder mask patterns being used with fine ptch BGAs. Undersized mask openings vs. the land/pad, Solder mask defined lands/pads etc. Thank You.
Electronics Forum | Tue Apr 13 07:08:34 EDT 2004 | mattkehoe
Dont forget, there is a method for BGA via in pad that is sometimes overlooked. Please look at http://www.sipad.net/sipadvip.htm It works!!!! mkehoe@sipad.net
Electronics Forum | Tue Jun 08 08:27:14 EDT 2004 | michaeljm
I would like to see the report from MacDermid. We have samples of ag boards in which the underside of PCB pad has been plated between the PCB laminate and pad.
Electronics Forum | Thu May 06 18:48:22 EDT 2004 | Dreamsniper
SUMMIT 750. My yield is 75%-98%. And they all depend on the pad design, stencil, paste, operator, thermal profile, etc. I have 98% yield on some of our products with good pad design. Process is easy to control. Dreamy
Electronics Forum | Tue Jun 01 18:13:19 EDT 2004 | black5629
I been using pads as fiducial, I am at end where the camera moves back and forth between the board and stencil, then it errors out.I been using single not multi, do I have to go to multiple since I am using pads? Thanks
Electronics Forum | Wed Jun 02 11:55:11 EDT 2004 | Rob
The way I understand it, Y boardstop is the edge of the board to and from your standpoint not left to right. And as I mention, the best vision is always fiducials not pads. I've worked with those before and I've always had problems when using a pad.
Electronics Forum | Thu Aug 19 08:22:05 EDT 2004 | Rafal M.
Hello. I have a problem with reflow soldering of PCBs with golden pads. Peste explodes in the oven. I don't know in witch phase of process (in what point of profile) it happens. It's the reason of problems with golden pads - it's dirty when going out
Electronics Forum | Fri Oct 15 10:38:42 EDT 2004 | mattkehoe
Thats what I was thinking especially because the pads are not round, they have jagged edges which to me indicates some kind of development issue. mk
Electronics Forum | Wed Nov 10 02:13:32 EST 2004 | Grant
Hi, We are thinking about starting to use via in Pad, for both BGA and 0402 and 0201 components. Does anyone know how this would effect production. Obviously PCB production is not difficult, but this should only effect production and assembly. R
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