Electronics Forum | Thu Apr 23 21:07:09 EDT 2009 | luismolinero
Emilio: Several factors you need to take into account and your process parameters will depend on: Solder Alloy, Is there any Fine Pitch?; BGA?; Smaller chip size?. Tipically you should go for controls in: Solder Temperature and viscosity; blade and s
Electronics Forum | Tue Apr 28 09:03:30 EDT 2009 | adamconaway
We have recently purchased a CP643, a CP6 and an IP3 in addition to our older fuji equipment. I am in the process of setting up the line descriptor on the MCS30 and I cannot locate the machine_type #'s for any of these machines. Can anyone help me ou
Electronics Forum | Tue Apr 28 03:05:48 EDT 2009 | nibirta
Hi, we are facing a problem with a cobar solder paste and i need some support here. We have 2 lots of solder paste: one makes solder balls, one no-solder balls. Can you suggest me any analyses that we can performed in order to see the differences bet
Electronics Forum | Fri May 01 07:22:56 EDT 2009 | kareal
In my project of flip chip PGA production , I found serious delamination in interface of solder mask and first layer copper trace of substrate after UHAST 96hrs( 130C, 85%RH) reliability test. The delamination are always around one type solder bump,
Electronics Forum | Fri May 22 08:04:30 EDT 2009 | stevezeva
Have any of you ever worked with Actel's QFN 180? A three row I/O QFN? Actel has a published paper on design and assembly guidelines, but we're finding that they are pretty much generic, and don't really work as well as they lead you to believe. ht
Electronics Forum | Sun May 17 00:41:17 EDT 2009 | microdot
hi, I am sorry if i sound offended anybody. What i meant is that we are handling boards which are from major manufacturers like hp / compaq / dell / ibm / intel. So if annybody has experience of handling it..than they may have reflow profiles of sa
Electronics Forum | Fri May 15 01:44:50 EDT 2009 | dilogic
Since UIC does not support older machines anymore, is there another way to upgrade our GSM1? We have an I-block hardware running OS2.11 and USOS 1.4.14. I would like to upgrade to USOS 3.xx, to be able to use Enhanced Product setup feature. Any hints
Electronics Forum | Fri May 15 10:04:59 EDT 2009 | aj
Hi all, Is there any standard for percentage voiding on the center thermal pad on a QFN? We use the dot matrix array for paste to allow for outgassing etc, but we have had a couple of xray inspection "fails" for voiding on this pad , in or around 3
Electronics Forum | Tue May 19 17:31:42 EDT 2009 | jamike
JUKI's the way to go, I feel getting one could be the saviour of a company if they want to run small & large batch sizes. Fairly quick setup times -after a bit of practice, reliability, very accurate placement of almost any component size. My lifes b
Electronics Forum | Thu May 21 12:40:58 EDT 2009 | ehess
Is anyone familiar with Easy OLP software for Samsung machines? I would like to back up the part info from the machines to the OLP s/w, so when we write new programs, the part info is correct, and matches the info in the machines. I have no documen
