Electronics Forum: casing (Page 79 of 246)

physical law of Dewetting

Electronics Forum | Thu Nov 01 12:13:10 EST 2001 | jonathan

I guess this clarifies the defect more then looks at the process, but I�ll just through it out there for the sake of learning something new. If anyone would comment on this please feel free�. There are many different varieties of dewetting defects.

clean process vs non clean process

Electronics Forum | Fri Apr 02 00:16:18 EST 2004 | Mike Konrad

There is no shortage of reasons to clean your boards. Soldering or reflowing your boards leaves �stuff� on them. This �stuff� is normally corrosive and conductive (some fluxes / pastes are more corrosive / conductive than others). In either case,

Solder wave shutdown

Electronics Forum | Wed Jun 06 15:59:25 EDT 2007 | chrisawallace

WML, I won't dispute math but I will definitely point out either bad math or a missed target. In your example, you are comparing "Energy used to heat the solder and keep it warm" versus "Energy used to keep the solder warm" and fully discount the fa

Assembling one side SMT one side TH

Electronics Forum | Thu Aug 11 15:11:35 EDT 2011 | davef

Franx: In response to your follow-up questions ... For the case 1: Q1: Should I apply the glue to the PCB with the same method as I apply solder paste? (with screen printer and squeegee). A1: Correct. Glue can be stencil printed, dispensed, or pin t

Quad IVc Part rejection issue

Electronics Forum | Sat Aug 18 00:49:56 EDT 2012 | audere

When I see this on my QSP2 it is always caused by the nozzle not seating ideally but I tend to set my tolerances really tight. To test mount a nozzle and look at Z height. Now pick up the part (which in my case will suck the nozzle upward due to the

Topaz X error

Electronics Forum | Fri May 10 01:42:13 EDT 2019 | vinitverma

A Table is something that you can ignore right now. It is significant only in case of dual table machines such as Sapphire or Sapphire-X which have A and B tables (two independent PCBs being handled at the same time). In case of Topaz or Topaz X or E

Non wetting spots of flex PCB pads

Electronics Forum | Fri May 26 04:58:19 EDT 2023 | auriga2001

I agree with the two other replies. Left alone, it is a defect. If it's just excess adhesive or coating, you can use IPC-7711/7721 'Rework, Modification and Repair of Electronic Assemblies' for guidance on removing. Section 2.3.1 explains how to te

Re: Reflowing a thru-hole part

Electronics Forum | Thu Sep 09 10:09:15 EDT 1999 | John Thorup

| | | I have a board that has surface mount on both sides . On this board is a 22pin connector which is the only thru-hole part.This part is located on the component side. I would like to reflow this part. Can this be done? If so, how can this be don

Re: Cracking Capacitors

Electronics Forum | Wed Sep 09 10:02:46 EDT 1998 | Earl Moon

| | | I am in need of possible causes and solutions to capacitors that are failing in the field. | | | Are there issues in our process that need to be | | | checked? | | | Some people said the problems are due to improper | | | storage. Others sa

BULK FEEDING

Electronics Forum | Sun Jun 21 18:06:45 EDT 1998 | Fred Dub

New developments in bulk feeding are making this process of feeding passive components more and more attractive to the PCB manufacturers, for whom the tape feeding for a long time was the solution. The rapid growth in the number of passive component


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