Electronics Forum: what (Page 788 of 1843)

Re: Use of Wood on PCB Assembly Production floor ??

Electronics Forum | Fri Mar 10 09:13:22 EST 2000 | Nancy V

Dave, Your response might have been helpful if you would have left off the extra, comical(?), comments. I am American and I still couldn't figure out what you were trying to say sometimes. Searching the web to find an ESD program and training seem

Solder cream kits (flux and powder separately)

Electronics Forum | Fri Mar 03 09:05:59 EST 2000 | Istv�n Dominik

I received data sheets from a paste distributor in which Amtech gives a recipe how you can mix solder cream. They deliver the flux in plastic jars and the solderpowder in foil packages. You must mix the two components with a simple mixing tool. Has a

Re: Removing Component Part Number

Electronics Forum | Fri Mar 03 14:01:49 EST 2000 | dean

This technique is commonly known as "black boxing". The majority of IC's are marked with ink. Simply use a tiny piece of sandpaper to "scratch the surface" and render the device blank. This will work with Laser marked parts as well. If your volum

Re: footprint formula

Electronics Forum | Fri Mar 03 10:12:41 EST 2000 | Dave F

Jack: "Calculator/Other" works for me. But you know what, I'll bet they block Scotts from using it, because they're reputed to be too cheap to buy the standard. ;-) (Your component is in the standard. ;-)) If you can't get the supplier to help and

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 15:20:13 EST 2000 | Glenn Robertson

Dave - You certainly have a good point regarding the multiple part numbers and board suppliers, but a rework process for black pad has been reported. See the SMTAI 1999 Proceedings article by Zequn Mei (page 407). It involves flux and solder wi

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 21:17:41 EST 2000 | Dave F

Dave: It's good to know what that stuff is. With your NiO, you have the typical ENIG problem. I can imagine some causes for your disaster: * too thin gold plating * oxidized nickel under gold plating * porous nickel plating * wrong soldering pr

Re: solder balls and flux

Electronics Forum | Wed Mar 01 10:46:26 EST 2000 | Robert Hartmann

Kelvin, Thanks for the help. The actual opening size is .440 mm, but I think what you said makes sense. After discussing with the customer, it looks like it is the height which matters, more than the diameter. We have learned that the height of t

Re: crystal mounting with foam tape

Electronics Forum | Wed Mar 01 17:29:30 EST 2000 | Eldon Sanders

Thanks Dave for your reply. I have found a supplier that can cut it, but I am trying to save the tooling cost and the minimum purchase dollar ammount imposed by the supplier. If an off the shelf item existed I could buy what I wanted when I wanted.

Wavesoldering of PLCC44 package

Electronics Forum | Fri Feb 25 05:42:17 EST 2000 | Istv�n Dominik

Hi, We should wavesolder a PLCC44 package. The PCB is under the design procedure now and we must specify the best parameters (the orientation (45 or 90 degrees) of the package on the PCB,the number, the positon and the size of the solder thief pads

Re: Sn96.5Ag3.5 Lead Free solder

Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F

Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con


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