Electronics Forum | Tue Jun 17 15:35:12 EDT 2008 | slthomas
But don't you need to control the rate of the drop in pressure? I'd think if you pull down quickly it just results in the same popcorning you'd see in a reflow oven. I just know it's not hard to boil water in a vacuum chamber. For that matter, it's
Electronics Forum | Wed Jun 18 11:33:21 EDT 2008 | slthomas
Dave, can I assume that in the case(s) you're referring to, there was no gas introduced into the evacuation chamber to push any expelled moisture out of the system? In the industry I was involved with (implantable medical devices), we used nitrogen
Electronics Forum | Wed Jan 23 18:15:33 EST 2008 | gsala
Hi, are you dealing with Leaded or Lead Free P-BGA ? soldering by Lead or Lead Free paste ? Any way, some time, bridges can be caused by moisture entrapped in the BGA body. Make sure if is respected the correct MSL's allowed flore exposure time, ot
Electronics Forum | Mon Jul 07 09:00:50 EDT 2008 | josh_brubaker
These images are of two melted matrix trays, full of BGA components, which were left to bake in an oven over the weekend. The oven temperature controller was not checked after a recent power failure and reached a temperature of 715�F. The two trays m
Electronics Forum | Wed Aug 27 00:21:53 EDT 2008 | kelson
Logan, My boards have gone through the baking process. After that, we ran through reflow of bottom side and washing. Due to inadequate parts, then we have on hold the reflow of top side. We kept the boards in a room. After 1 week, we noticed there w
Electronics Forum | Tue Sep 02 14:59:41 EDT 2008 | hermes
if two boards with different solder masks give different results on flux residue level after soldering with the exact same machine settings than it is clear that one of the solder masks is not compatible with your no-clean flux. could be the solder m
Electronics Forum | Tue Sep 09 16:04:25 EDT 2008 | allan99
I don't think so if your process is a just in time rework, you have just to develop a profile at your rework station for each component and also clean the place (board) properly. If your process is not a JIT rework, you must have to bake the boards,
Electronics Forum | Thu Dec 11 11:59:23 EST 2008 | joeherz
Update - We've tested a board previously having voiding issues with ENIG versions and the voiding has completely disappeared. No other variables were changed. Looks promising. I have an order of LF HASL boards arriving soon that we plan to split i
Electronics Forum | Fri Nov 21 18:28:42 EST 2008 | Frank
In the good old days, I've made raw boards at home. Layout the design and then transfer it to a bare copper clad board. Etching it out is the fun part. I grabbed our 9x13 pyrex baking dish from the kitchen. Using metal etching dish doesn't make
Electronics Forum | Mon Dec 29 09:10:22 EST 2008 | stepheniii
It takes time for the moisture to penetrate into the body. I think the 5 years of ambient would be more the culprit than washing the boards. Especially since you are baking them after wash. Get a few of the ICs and put them loose on a board and put
