Electronics Forum | Thu May 11 07:19:36 EDT 2023 | richardcargill
There's a chance the vision system is seeing part of head 1 as it looks at the component. We get that with older nozzles on Philips equipment ( the black coating has worn to a silver shine ) and the component camera sees the nozzle tip, which annoyin
Electronics Forum | Fri Oct 13 10:44:03 EDT 2023 | yannick_herzog
Hello, thank you for your responses. Some time has passed since then. Unfortunately, we have been facing the issue of incomplete filling in the production when it comes to large openings in the template. This phenomenon occurs in both directions. T
Electronics Forum | Sun May 21 05:54:04 EDT 2000 | Sal
Currently manufacturing double-sided PCMCIA cards with a nickel/gold finish, which are 0.0235thou in thickness, using surface mount carriers. Problem we are seeing is when building the densely populated side on the second pass we are seeing lifting o
Electronics Forum | Mon Apr 23 17:30:08 EDT 2001 | davef
Step 1: Print paste on the board, skip placement, reflow the board, check solderability. Step 2: Goto Step 1. White Tin Solderability: The most common reason for solderability issues with the white tin surface coating during multiple thermal excur
Electronics Forum | Tue May 08 03:14:12 EDT 2001 | sinclair
We started our first ENIG process recently and to our surprise, we have many failure on the one and only BGA on the board. The BGA is a 31 mils pitch plastic. Sending the PCBA to 1 cycle of heating/cooling @ 70/-5 degree C yield 40% of failure. With
Electronics Forum | Mon Nov 22 11:16:04 EST 1999 | Boca
Chris, Some ramblings- Your choice depends on factors like which defects you're looking for, bugdet, quality inspection philosophy, high or low mix environment, sample sizes or 100%, and so on. Are you going to test 100% of the product coming off t
Electronics Forum | Wed Jul 21 01:52:40 EDT 1999 | Scott McKee
| Dear all | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | Our appliocation is Mainly fabrication of mother boards. | Thanks | In theory, ICT is the classical answer (In-Circuit Test). In practic
Electronics Forum | Fri May 14 00:16:28 EDT 1999 | Mike D.
| Does anyone know of any industry guidelines for the exhausting of volatiles in reflow ovens? I've seen some numbers like 1,000ppm for the oven atmosphere, but is this typical? | | My concern is the volatiles in my WS629 solder paste may be attack
Electronics Forum | Wed Apr 21 12:01:22 EDT 1999 | jseagle
| To all who will be potentially my salvation, | | I am currently researching Polyimide stencils for possible use and manufacture. If I may be indulged - with due reference to all past enquiries and notes on the subject - can anyone offer an up to d
Electronics Forum | Thu Jan 28 12:49:43 EST 1999 | Steve Gregory
| Hi ! | | Does any one used no-clean solder paste for SDRAM product ? | Please advise. TQ. | | Tony Hi Tony! Yes I have...at a memory company I worked at in the past. Let me guess why you would ask that...whatever you're building that us
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