Electronics Forum | Sun Aug 20 21:43:19 EDT 2006 | darby
Yes, I agree with guest. Lay it all out with masking tape on the floor. Include the width of feeders sticking out. Confirm the position of power, air, network and smema connections. You may even want to use cardboard layed out on to the floor. You ha
Electronics Forum | Mon Aug 14 18:03:49 EDT 2006 | GS
Sure the bake need to be done after BGA replacement? Normally the board need to be backed before BGA replacement (not only)in order to avoid PCB delamination due to moisture entrapped during his life staing on field. Oven Temperature from 90 to 125
Electronics Forum | Wed Aug 16 03:48:24 EDT 2006 | umar
Hi All SMT Net Team Member, I always have problem at MY SMT process and production side, Every time product running at my production side always found a lot solder Ball issue near the pad of SMT chip component. We had quite hard to do the trouble s
Electronics Forum | Fri Aug 18 00:23:21 EDT 2006 | umar
Hi SWAG/Rush/Steve, Thanks for your response, Currently I am running with 811 lead paste. Actually this problem not only effect for one assy. I got 700 models runing at my company, but almost 50% of the model I have problem with solder balls issue.
Electronics Forum | Fri Aug 18 07:37:13 EDT 2006 | Chunks
Hi Umar, I believe you either are over printing these pads or the alignment of board and stencil may be off. Check your print right after your screen printer to verify either. If you are not over printing and your paste alignment is spot on, then
Electronics Forum | Wed Aug 23 14:59:32 EDT 2006 | bill
I�ve been lurking on the forum for a while so I will take a stab at this, mainly because there is no answer I take it that you have a variety of boards being produced at the same time and are in fixtures so the conveyors don�t need to be adjusted, a
Electronics Forum | Mon Aug 21 10:36:25 EDT 2006 | vikkaraja
I Think I understand your problem. But I think it would be best if you just go in the program and change/check your componet height as needed. It does not take much time. Check your cap height, modify shape data as needed, generate your program and
Electronics Forum | Fri Aug 25 07:38:12 EDT 2006 | CL
Hi CP, I used to work for a flex circuit manufacturer. I am at a CM now and am we have started building RoHS production status assemblies. I personally think flex circuits will have a difficult time with the required temps for RoHS. I spoke to someo
Electronics Forum | Thu Aug 24 15:54:13 EDT 2006 | davef
It depends. What is: * Storage environment and period * Board laminate, epoxy, and copper thickness of PTH * Down stream process * Etc FR4 0.062" thick boards absorb between 0.08 to 0.1%Wt of moisture within a 24 hour period, and 0.2 to 0.23%Wt in
Electronics Forum | Tue Aug 29 08:11:12 EDT 2006 | davef
"... we've coerced Josh into driving us out to Watson's bay, braving the horrendous parking situation, to visit Doyle's." Good for you, but you could be parking on a sinkhole: http://www.uwsp.edu/geo/faculty/ozsvath/images/winter_park_sinkhole.htm
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