Electronics Forum | Fri Sep 06 14:03:18 EDT 2013 | horchak
If you are a CEM you are setting yourself up for failure and will be left holding the bag. Flash gold has one purpose. It is a protective coating for the base medal to keep it from oxidizing. It is very thin and will be absorbed into the solder joint
Electronics Forum | Thu Feb 04 18:45:56 EST 1999 | Earl Moon
| Actually, solder paste adds about 12% to the joint volume for PBGAs, or about 31% for MicroBGAs -- assuming standard (recommended) pad sizes and stencil thicknesses, and paste with 90% metal content (50% metal by volume). Michael, In the "real wo
Electronics Forum | Thu Aug 05 06:29:18 EDT 1999 | Graham Naisbitt
| | | We're getting field failures in a high impedance portion of the circuit. Think the unpopulated pc card has contaminates because we were able to grow dendrites by applying a 9 volt battery across the suspected pad, placed a drop of de-ionized w
Electronics Forum | Tue Apr 13 13:45:26 EDT 2004 | arcandspark
Ken you say reaching 218 to 221 C will give a homogenus solder ball. The pb free solder balls on the BGA reflow at 235 C to 238 C but I have seen when you combin to differnt types of solder say 63-37 and 10-90 you will atually lower the melting point
Electronics Forum | Thu Jul 20 17:07:49 EDT 2000 | JACKIE O'ROARK
Hello Bob, I am going to be working with a 5 Mil Flex circuit. There are 2 components to be placed on. I thought of using the conductive glue but after reading your message not recomending it, I am swayed againist it. What is the best way to place
Electronics Forum | Tue Apr 27 12:19:17 EDT 1999 | John
Has anybody had experience wavesoldering 1 watt 2512 resistor packages?? I know it can be done, but are there reliability issues? We are in the middle of a new product and the question was posed to me "Can we use 2512 1 watt resistors on the bottom
Electronics Forum | Tue Jun 17 09:22:02 EDT 2003 | davef
Higher that recommended is more brittle. Look here: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=17906 Q2: Will some of my Ceramic Caps crack during the wave soldering process because of the heat? A2: Probably Q3: Can you see any pos
Electronics Forum | Fri Aug 03 11:09:33 EDT 2007 | realchunks
Well, Ray Rassmussen believes that "IT" may put China on it's ear. Not sure about any of you, but I never felt the need to splash water on my face whilst reading this white paper. Hate to see how he'd react to seeing a board going over a 500 degree
Electronics Forum | Wed Jan 21 04:14:19 EST 2009 | sachu_70
Hi Adam, I would suggest you refer IPC-2221 guidelines which define plating thickness as: Nickel 2.5-5.0 um , Gold 0.08-0.23 um. Although ENIG is a standard process, there is an associated risk towards Gold embrittlement, Porous Gold, or Black pad de
Electronics Forum | Thu Jun 10 16:58:40 EDT 2010 | daxman
I've worked at several companies that have used Smart Sonic ultrasonic cleaners. About a year ago, we purchased the Smart Sonic 1550 and Enviroguard. The Enviroguard produces DI water for rinsing and also handles the solder waste. Also, Smart Sonic h
