Electronics Forum: timely (Page 793 of 1078)

MVP 1820 AOI

Electronics Forum | Thu Sep 07 08:18:19 EDT 2006 | Rob

Hi Pavel, Great machines - very good for high volume - we did a lot of OEM overflow work and for fault finding & speed it kicked the other more expensive machines into touch. However... Programming is a lot slower initially than some of the othe

FMI Protocol

Electronics Forum | Wed Aug 30 03:58:26 EDT 2006 | Ola

Yes you do need a different upline interface card. This information should be in Your Technical Reference Manual, Electronics enclosure chapter 6? Y2 Enclosure, card position X8 Downline and X9 upline: Part No Description. 112045 Base Card

AOI

Electronics Forum | Thu Sep 07 09:32:14 EDT 2006 | tony_d

Hello Saaitk, I was recently tasked with selecting an AOI system for our company. We are a low to medium manufacturer as well. I looked at several different vendors and narrowed the field to Mirtec and Yestech. I found that the programming was v

Infromation request from advantis users

Electronics Forum | Mon Aug 28 13:14:49 EDT 2006 | SWAG

We just bought an Advantis w/flexjet head. Great machine. No problems with anything and Universal support is excellent as always. Prec-Pro dual lane feeders are the way to go. Also, I recommend buying the NPI module. This software allows you to

MPM UP2000 Hi-e

Electronics Forum | Tue Aug 29 10:36:09 EDT 2006 | Chunks

With the UP2000 that has vacuum board hold down, the Grid Loc hoses defeat the vacuum in order for them to exit the work table. Big boards require more girds, thus more hoses. Set-up between large and small boards takes time to remove or add the gr

MPM UP2000 Hi-e

Electronics Forum | Thu Aug 31 19:40:22 EDT 2006 | cardinal

A couple things on the Grid-Lok system. They now offer a top-side edge clamping system. The edge clamping system works very well for warped, twisted boards etc.. Using this system in the auto mode also allows the pins to contour to the geography of

Qualification requirements for immersion tin finish

Electronics Forum | Wed Aug 30 08:20:40 EDT 2006 | Bob R.

Are there any standard qualification/acceptance requirements for immersion tin board finish? J-STD-003 calls out temp/humidity preconditioning followed by solderability testing which is similar to what we have in our (ancient) internal documents. O

0.4mm PCB Thickness - production issues

Electronics Forum | Thu Sep 14 06:45:11 EDT 2006 | Rob

Hi Mika, We had roughly the same set up - AP27 -CP6x2, GSMx2, VIP98 & we ran the thin boards with durastone routed pallets. If you route out a 0.4mm pocket on the pallet and either use kapton tape/high temp masking tape/ or 3M spraymount to hold

0.4mm PCB Thickness - production issues

Electronics Forum | Thu Sep 14 19:19:38 EDT 2006 | SWAG

I would try to panelize as big as you can for sure as you'll spend more time handling single boards than running anything. Additionally, this size is very close to smallest capabilities on GSM depending on your configuration. Fids on all boards in

What do you do ?

Electronics Forum | Thu Sep 14 05:11:29 EDT 2006 | ?

All, We are a contract manuf. for electronics. Since changeover to RoHS we still have customers due to one thing or the other telling us to run Non-RoHS. They are not exempt. What do we do ? do we tell them that we are not running their boards and


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