Electronics Forum: casing (Page 80 of 246)

Re: BULK FEEDING

Electronics Forum | Fri Jul 10 00:04:44 EDT 1998 | Fred Dub

| New developments in bulk feeding are making this process of feeding passive components more and more attractive to the PCB manufacturers, for | whom the tape feeding for a long time was the solution. The rapid growth in the number of passive compo

Moisture Sensitive part - baking

Electronics Forum | Sat Aug 25 08:39:15 EDT 2007 | gsala

If plastic Carrier Tape (CT)/ emboss tape, is made by: a)Polycarbonate material, it can withstand temperature around 120C� or may be more mantaining original dimension. b)Polystirene material, at max 45�C-50C� the CT starts to change dimensions and

Re: SMT Programming - Parts Database set-up for contract manufacturer

Electronics Forum | Tue Feb 22 23:52:06 EST 2000 | Finepitch Services

Jax, I appreciate your opinion and no one is right or wrong during such information sharing. Please consider that we all inherit a system and keeping it in the same way is the choice in most cases. Also, "keeping the mm across the house" is not gi

Re: Lead Contamination....Coplanarity???

Electronics Forum | Fri Feb 11 13:36:40 EST 2000 | Finepitch Services

Jeff, I guess my experience in such issues always took me back to the screen printing process and I only want to bring up that portion of the possible causes to this case. When we talk about coplanarity, the component lead coplanarity first comes t

Re: 0402 pick problems

Electronics Forum | Fri Nov 17 00:27:30 EST 2000 | DL

Kris, I gather from your description that the component can not be picked consistently. Meaning that the machine can place the component. How does the component place? Is the placement text book? Take a good look to see if the component isn't being

Re: Stencil for 10 mils IC

Electronics Forum | Mon Nov 13 04:57:27 EST 2000 | Wolfgang Busko

Hi Richard, I assume that you deal with a component that has 20mil pitch. In this case depending on your pad design you get from 8 to 10mil spacing for your apertures. With a slight reduction of the aperture (10 to 15% for avoiding shorts)and a 6mil

Re: Poor soldering on Motorola 357 PBGA

Electronics Forum | Fri Oct 27 15:22:08 EDT 2000 | Glenn Robertson

Chris - You are not the first to see this problem. I have seen a similar case on parts from another company. There may be a way to "clean" the parts but I'm not aware of it. Maybe someone else will have an idea. I suggest you ask Motorola h

Re: to seal exposed copper layers

Electronics Forum | Sat Oct 21 03:55:14 EDT 2000 | DL

Dennis, I've seen this before, and in our case we didn't need to seal the edges because there was no concern of shorting or anything in the end product, this is a choice you will have to make, Does your end product have any protrusions or mounting h

Re: Bulk Feeding roadmap

Electronics Forum | Mon Sep 25 09:42:45 EDT 2000 | JAX

Bulk feeding components was and is a great idea, but it seems to stop there. Many P&P equipment vendors have bulk feeding capabilities and most part suppliers sell in bulk cartriges. The problem is in the use. How do you verify resitors that are sitt

Re: Ceramic case resonators falling to pieces after reflow soldering.

Electronics Forum | Wed Aug 30 14:57:43 EDT 2000 | John Thorup

Hello Craig Are code dates other than these two coming apart or do they stay together? If other dates stay together you should get together with RFM. Did the process work before and and the defects just start happening? These are pictured on the RFM


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