Electronics Forum | Fri Dec 12 10:28:30 EST 1997 | David Syracuse
I am interested in locating a water soluble resist mask that does not leave a residue after wash and is easy to work with during the screen printing process. I have tried the Alpha Metals 110 and 220 solder mask and have found that it does not leave
Electronics Forum | Tue Aug 28 12:05:42 EDT 2001 | mparker
The advantage of DPMO is that the numbers used are PPM, (Part Per Million), rather than percentage. Percentage can distort, depending on volume. For instance, 100 units processed, 25 defects found = 75 percent yield. 4 units processed, 1 defect found
Electronics Forum | Sat Nov 03 05:19:59 EST 2001 | Ben
Hi I have question about thermocouple type use for Super M.O.L.E. I found in some article that type K T/C (Nickel-Chromium vs. Nickel-Aluminum) may suffer from temperature cycling hysteresis at above 250 degree C and also diffecult to solder. Now
Electronics Forum | Sun Feb 24 13:52:47 EST 2002 | bentzen
Hi Armin Printing equipment can be divided into two main groups; In-line and off-line. For "small" production sites an off-line screen printer should be adequate but for high out-put placement lines, where the product cycle-time is short, an in-line
Electronics Forum | Thu Apr 11 04:03:28 EDT 2002 | mwoodall
The Alpha metals Hi Check 500 is used to measure paste deposit thickness. The paste height is found from a micrometer reading determined by focussing a beam of light on a track adjacent to a paste deposit and then onto the solder paste. I've measure
Electronics Forum | Tue Jun 25 15:30:49 EDT 2002 | Steve L
Hi everyone. I am now faced with a problem on soldering PBGA. At first, I ran the board (FR4, 7" X 10" with 12 layer) at Peak Temp: 205 C and 54 seconds above 183 C. After reflow, I found several cold solder joints and one ball without second collaps
Electronics Forum | Thu Jun 27 11:22:03 EDT 2002 | robbied
Hi there. We have had an out of control reflow oven that has allowed its temperature to fluctuate by up to +/- 20 deg C from set point in very short periods of time. We found the root cause of the problem and fixed it, but by then we had already run
Electronics Forum | Thu Nov 07 09:23:05 EST 2002 | russ
What would the considerations be in utilizing a type 4 paste as opposed to type 3? We have an assembly that has a large amount of uBGAs (12 mil diam pad)along with 50 mil pitch BGAs assorted fine pitch etc... We are experiencing difficulty in paste
Electronics Forum | Fri Jun 06 16:11:25 EDT 2003 | RF Lurker
I understand that there may not be a lot of material on this, as most threads I've seen discourage doing it. It goes against DFM to do it. But I wish to use a large copper area instead of heat sink and thermal epoxy to cool a regulator. But I can'
Electronics Forum | Sat Nov 22 18:51:14 EST 2003 | lkavan
So, I have a documentation and service manulal for HS180 now. I checked HPIB addresses, it is all right. But I found, that I cannot edit whole config and machine data. In manual is written, that all datas you can edit during first instalation only. I
