Electronics Forum | Wed Jul 14 13:50:11 EDT 2010 | swag
I can't offer much advice on acceptible rates or #'s. From a process standpoint, most of your bridging or insufficient originates in your printer. Look into buying dedicated tooling specifically designed for the build. We use "h-towers" on all hig
Electronics Forum | Thu Oct 18 11:08:22 EDT 2012 | scottp
Since we follow IPC Class III, I've done experiments turning N2 on and off and measuring void level with both SnPb and SAC305 solder. In both cases there was a statistically significant, measurable increase in voids with N2, but it wasn't significan
Electronics Forum | Tue May 19 10:23:06 EDT 1998 | Mike C
| Howdy Richard, | Welcome to the club! I now dub thee a full fledged member of the "Spotty Gold Finger and Bleeding Ulcer Society"...or SGFBUS for short... (GRIN) | I know it's not funny to be in that position, but there's so many different places t
Electronics Forum | Fri Nov 05 10:35:18 EDT 2010 | methos1979
This was a great post from another thread here with some tips: Date: November 04, 2010 07:42 PM Author: eadthem Subject: Who has best desktop AOI ? We do almost exclusively SMT parts but for solder with a 45 degree fillet angle use vertical light
Electronics Forum | Sat Mar 11 15:05:54 EST 2006 | Kerm
Hi Craig: I agree with muse. The problems almost always will show up later on duringg life cycles in terms of reliability problems. While the solder joints may look acceptable right after production there is no guarantee of meeting the reliability r
Electronics Forum | Thu May 07 12:54:01 EDT 1998 | DARRYL SCHLOSSER
| I am running a board that is .062" thick and has components that over hang the edge of the board by .090". I have bottom side smt components (chip caps and resistors only) and use the turbulent wave to help solder the components. The problem I am
Electronics Forum | Wed Oct 25 12:38:05 EDT 2000 | Phil
Hi there!! You know what your QA is doing is right, coz by measuring the solder paste height can avoid the following defects: 1.Insufficient solder 2.Short solder or bridging 3.Solder balls SPC monitoring for paste height checking is required
Electronics Forum | Mon Sep 10 02:47:27 EDT 2001 | Peter W.
Thank you for your annotaions. I am aware of the limits and temperatures of that material, but we are doing some research with thermoplastic base materials which won't survive standard solder paste reflow soldering. And beside of using conductive ad
Electronics Forum | Thu Nov 06 09:10:13 EST 2003 | successmani
hi, NEMI recommends separate solders for reflow sodlering and wave soldering. Reflow soldering- Sn-3.9Ag-0.7Cu Wave sodlering- Sn-0.7CU Wavesoldering- Sn-0.7Ag What will happen if a mixed technolgy PCb board containing both through hole and surface
Electronics Forum | Thu Jun 16 22:14:51 EDT 2005 | davef
16 thou pitch parts: Use a 5 thou laser cut electropolished stencil with 0.008"x0.045" apertures and type 3 solder paste. Bridges Connecting or Partially Connecting Adjacent Leads or Lands * Excessive solder paste * Excessive component placement pre
