Electronics Forum: what (Page 794 of 1843)

Re: Stencil Basics

Electronics Forum | Mon Oct 02 11:20:44 EDT 2000 | aaronho

It's not really you need a book. You can ask your stencil supplier for what to... The supplier should be an expert in stencil making. Basically pitches and apertures should be made to the spec in CAD data of PCB. You can ask to make to 90% size of pa

Re: Re:What are differences in Mil-P-50884C Vs Mil-PRF-31032/3

Electronics Forum | Sat Sep 23 09:50:40 EDT 2000 | Dave F

KC, Try: Mil-P-50884C - http://astimage.daps.dla.mil/quicksearch/basic_profile.cfm?ident_number=27738 Mil-PRF-31032/3 - http://astimage.daps.dla.mil/quicksearch/basic_profile.cfm?ident_number=201451

Re: Capability Study for Solder Printing Process

Electronics Forum | Thu Sep 21 10:07:53 EDT 2000 | Mike Rowell

Hello Sophia, I am an applications engineer for Speedline/MPM. I'd be happy to help you with your questions. feel free to e-mail me or contact me at Speedline/MPM. There are many factors that could cause problems with the print process, I would pref

Re: PCB Material

Electronics Forum | Wed Sep 13 20:58:50 EDT 2000 | Dave F

If you don't know what you have, how the blank are we sposed to tell you? Try your local fab. CEM1 - Opaque tan CEM3 - Translucent FR2 - Opaque brown FR3 - Opaque cream FR4 - Translucent FR5 - Translucent FR6 - Opaque white G10 - Translucent G11 -

wafer to waffle

Electronics Forum | Mon Sep 11 00:31:13 EDT 2000 | rcsantos

Is there somebody who knows if there is a machine already available in market that can transfer die from wafer to waffle tray. This machine should a stand alone type or can be integrated to some P&P machine. What I'm trying to say is just like the on

Re: PCB snap-offs

Electronics Forum | Thu Aug 31 05:20:08 EDT 2000 | dougie

Thanks for your help guys. We've V-scored boards in the past and it led to difficulties, as mentioned with the depth of groove etc... Our PCB's vary in shape and size drastically, and I mean drastically. So it looks as if a little more though on wh

Re: Stencil Cleaner

Electronics Forum | Tue Aug 29 10:04:50 EDT 2000 | Dave

Francois, It appears from "G's" admission in his earlier posting that his "study" was based on the evaluation of 2 pieces of equipment - one high pressure spray system and one ultrasonic system. There are other alternatives...low pressure, high volum

0603 tape cavity size

Electronics Forum | Fri Aug 25 00:15:15 EDT 2000 | Wilson

Hi all, Does anybody meet large size of tape cavity in 0603 components? It is a serious problem in some vendors that their tape tolerance is very large. It lead to our fallout rate abnormal high. What is standard tape cavity size? Why the componen

Re: solderballs after wavesoldering

Electronics Forum | Tue Aug 22 14:02:02 EDT 2000 | JAX

Caumel, You should be able to find sufficient info in the archives. Solder Balls probably hold the majority of posts and should be easy to referance. You can find out what causes them in relation to board material, profile tempature, wave type, flu

Re: FAQs, archives, and the never-ending story

Electronics Forum | Thu Aug 24 19:59:48 EDT 2000 | Earl Moon

Finally, Two big time, intelligent responses to my crap. Wolfgang, you do it right by answering real questions with real stuff. Steve, unless you are JAX or SUN (one in the same), those are fair comments. I do not mean to frighten anyone off the fo


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