Electronics Forum: you (Page 795 of 3791)

Converting to 'No-Clean' process

Electronics Forum | Fri Apr 14 13:30:20 EDT 2000 | Murad Kurwa

Hi All: Can you tell me specifically if you converted an exiting product made with Clean process using WS609 or compatible to 'No-Clean' process. We have to convert assemblies from current clean process at a CEM to No-Clean process in our own factor

Re: Help Bottom Side Components

Electronics Forum | Wed Apr 12 20:56:18 EDT 2000 | Dave F

Kevin: You're correct. Loose the glue, unless you're waving second side or have real heavy components. Check the archives for component weights, references, and what not. I believe that most people (let's see a show of hands kids) are using two pa

Re: Solder Mask Bubbling off after Wave Soldering

Electronics Forum | Tue Apr 04 04:55:31 EDT 2000 | Jesper K

It's a typical answer from a board fabricator - 'None of our other customers have these problems'. But, and correct me if I'm wrong, none of the other customers uses the same PCB's as you do! Your preheat-parameters looks OK - they should not be giv

Re: Cleaning No-Clean Paste??

Electronics Forum | Fri Feb 25 14:34:44 EST 2000 | Ioan

Larry, the best paste thinner is the one that your paste supplier recommends. You should check with him. We have no problems removing the no-clean paste with alcohol. If you want to give it a try, make sure you use IP alcohol, not alcohol based flux

Re: Farewell to fellow old-timers and up-and-comers alike

Electronics Forum | Fri Feb 18 10:03:55 EST 2000 | Cunli

Scott, Sorry to see you leave SMTnet. I want to thank you again for being the most frequent contributor in the early days of the Forum, and for your continued partipation and help as editor of the SMT Express. Since archived messages only go back

Effective Alternatives To Stencil Cleaning

Electronics Forum | Tue Feb 20 21:19:43 EST 2001 | davef

You�re correct, many of us recognize that problems in paste deposition are the source of the majority of SMT component defects. What would you say that the portion of the "51 to 72% of all solder defects are the result of screen-printing problems" t

CGA devices - placement and vision

Electronics Forum | Mon Feb 26 16:26:00 EST 2001 | jax

I have not placed these parts in a while but when I did Universal was the machine that did it. We were able to place these parts using a 1mil flat( upward looking camera) inspecting all columns. The problem is a 100% column recognition is not possibl

Universal GSM dumping trays with parts still in!!

Electronics Forum | Thu Mar 08 09:08:47 EST 2001 | jax

Your safest bet is to manually remove the trays. The problem with what you want is that the machine does not know that it missed a part. It simply goes to the point you specify and tries to pick somthing up; if it doesn't pick up anything it believes

reworking brds by flowing the board thru' oven for the 3rd times

Electronics Forum | Mon Mar 19 08:56:17 EST 2001 | fmonette

One very important consideration in your situation is to determine if you have moisture sensitive components on these boards. If you have any device classified level 3 or higher then you have a very high level of risk associated with moisture sensit

Promote Your Company and Yourself with Papers and Technical Arti

Electronics Forum | Fri Mar 23 10:26:47 EST 2001 | Andre

Your papers and technical articles are in demand for use with the SMT Express. We would like to offer our readers well-written technical articles covering issues crucial to the SMT industry. Your contributions will help you by making your name know


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