Electronics Forum: through hole (Page 81 of 139)

BGA Via Tenting

Electronics Forum | Fri Jan 21 16:50:33 EST 2005 | Board House

I work for a board house and our proceedure for this process is the following, We cover the via pads leaving the hole open and then apply the surface finish and then go back and Cover the Via with a second operation. By doing this you do not entrap

Re: No Feeder Compatibility with Gem Series

Electronics Forum | Mon Nov 30 10:04:26 EST 1998 | Clint Hardee

Yes, the GEM series feeders are quite different. In fact, if you put CSM feeders on a GEM machine, you will probably break nozzles and crash the head due to the fact that the CSM feeders have a mechanical arm that sticks up toward the front of the bo

ESD Safe Fasteners

Electronics Forum | Tue Jun 25 09:29:50 EDT 2002 | CPI

I�m looking for some type of fastener to secure identification tags to boards. The method would be inserting through a tooling hole on the brd .25� npt. We had been using nylon fasteners much like those used in the garment industry. However I am look

Conformal coating (again)

Electronics Forum | Mon Jan 26 20:17:01 EST 2004 | davef

Some temporary solder masks outgas ammonia as they cure. It's possible that the first side cured and out gassed through the grounding hole. But when the second side cured, it outgassed between the board and the coating and in so doing reacted with

Securing components for wave soldering

Electronics Forum | Thu Jul 15 07:08:29 EDT 2004 | pcbrown

Basically, it's a tilting problem of certain devices. Usually with axial by-pass caps tilting, which pulls the lead up through it's mounting hole. Other problems with components with leads cut to lenght to eliminate post-wave trimming. All suggestion

Best practice to validate the old - more than 5 year old parts

Electronics Forum | Thu Dec 12 17:39:14 EST 2019 | davef

When I hear "pinholes" in solder connections, I think of two sources, depending on the situation, which can be either: + Entrapped air and process chemicals develop during reflow soldering to cause the pinholes in and around the intermetallic layer

Re: Broken capacitors

Electronics Forum | Mon Dec 04 11:14:03 EST 2000 | JimH

All, For what it's worth the only time I have experienced this phenom was when board support pins were misplaced on our chip shooter and these components (previously placed) were resting on the pins and cracking when we populated the other side o

Re: High Temp Solder Application

Electronics Forum | Fri Nov 10 17:47:50 EST 2000 | Dave F

I can�t imagine a high trace count, high via count ceramic board matching-up on price with a FR4 board. http://www.coorstek.com/coorstek/coorstek.asp?menu=literature&reference=literature.asp But that�s not really the issue, is it? The issue is the r

Wave solder Carrier (WSC)

Electronics Forum | Wed Oct 25 06:14:14 EDT 2000 | Adam

Guys A question regarding design rules of a WSC.We are currently running a high volume product, and as usual the design layout is as such where half the through hole connectors are perpendicular to the wave, and surprise,surpise the other half are'n

Re: White residue on PCB's

Electronics Forum | Fri Oct 13 05:21:08 EDT 2000 | Robert Steltman

Looking at the original post, it seems that the white residue is formed on the board after wave soldering and becomes evident when it has been left standing for a while. From what I understand, it seems that the solids content of the "no clean" flux


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