Electronics Forum | Thu Aug 05 04:32:21 EDT 1999 | Wolfgang Busko
| I am currently in the process of setting up an SMD Parts Package Database. The database will contain dimensional information to be used by the placement machinery to process parts (I.E Package Type, # of Leads, Lead dimensions, Lead pitch(s), etc.
Electronics Forum | Thu Aug 05 11:15:39 EDT 1999 | John Thorup
| | | | | | | | | Hello, | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip compon
Electronics Forum | Mon Jul 26 18:01:30 EDT 1999 | Earl Moon
| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F
Electronics Forum | Thu Jul 29 15:44:29 EDT 1999 | Earl Moon
| Thanks Earl for your insight! I sometimes feel conspicuous as one of the few women I've seen frequenting this board, but everyone's been helpful and has resisted the overwhelming temptation to pat me on the head. | | From what you and some of the
Electronics Forum | Fri Jul 16 14:34:18 EDT 1999 | Glenn Robertson
| We are converting from COB to SMT on a product line and want to optomize the PCB as far as Laminate, plating, passivation etc. This is a high temp application 150C. We are presently using BT Laminate but would like to get away from this. We are
Electronics Forum | Thu Jul 15 19:05:58 EDT 1999 | Earl Moon
| | | We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec
Electronics Forum | Wed Jul 14 13:10:49 EDT 1999 | Earl Moon
| I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run it
Electronics Forum | Wed Jul 14 13:22:51 EDT 1999 | kt
| I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run it
Electronics Forum | Tue Jul 13 14:17:00 EDT 1999 | Scott
| I am looking for suppliers of ESD floor coverings. I currently have ESD carpet and I would like to replace them with ESD Tile. Help Me | | MD Cox | | Here's a few numbers to call, most are manufacturers that will have a Rep in your area: 3M
Electronics Forum | Tue Jul 06 10:12:44 EDT 1999 | John Thorup
| | Is the no clean solder paste as good? We are wondering if we can elliminate the wash when we change from through hole to surface mount. | | | John, | | No clean is as good as your process, and the paste you are using. Everything I do is no cle
