Electronics Forum | Wed Jan 16 20:06:09 EST 2002 | davef
No, not as such. Consider: * Using the IPC calculator [free at http://www.ipc.org]. It allows you to consider / assess the amount of solder when designing pads. * Reviewing IPC-7525 - Stencil Design Guidelines. It gives general aperture guidelines.
Electronics Forum | Wed Feb 27 19:55:13 EST 2002 | nifhail
Hi, I need help to understand further on the via in pad for 0402 requirement. If I were to do the DFM over the brd design which consist of 0402 with via on pad, what is the criteria that I should look for ? I learned that the via in pad does not wor
Electronics Forum | Fri Mar 29 11:32:37 EST 2002 | slthomas
Thanks, Larry, more good info. I think my designer has that spec. in his library. What we DID find that while we had the proper pattern called out in our in house spec. sheet for the part, the designers don't look at the spec. sheets. They just grab
Electronics Forum | Mon Apr 29 02:50:03 EDT 2002 | Bob Willis
The basic guidline is lead size plus 0.010" which you can also use for through hole reflow/intrusive reflow. Most suppliers of the insertion equipment quote this as the minimum clearance hence its a good guide. Druing recent trials for through hole
Electronics Forum | Tue Jun 04 17:21:22 EDT 2002 | jasonfang
I found solderballs are around chip components (on one side of middle area), I checked gerber data, solder paste of aperture on the stencil for these chip components have 5% reduction to solder land on PCB, shape of solder land are square, not home p
Electronics Forum | Fri Jun 21 12:49:58 EDT 2002 | surinder
Hi Russ, Thanks for your input.My board has SMT Chip components, SOT23,SOIC's & 2QFP (25MIL PITCH). Also,taking consideration that the board is well design for Wave.This board has been designed end of last year. We have latest model of Electrovert ma
Electronics Forum | Wed Jul 03 14:08:10 EDT 2002 | gbriceno
I' designing a PCB with SMD components to optimize the land patterns for wave soldering. I find that the IPC-SM-782 land patterns are not robust enough for wave soldering, yielding ramdom skips and bridges. This PCB will also give me insight on sha
Electronics Forum | Thu Oct 03 15:14:46 EDT 2002 | SMTGuy
Good Day Everyone, Can anyone offer any advice on 0201 aperture design? We are looking at an application that will require them. We would like to do some experimentation first. Also, assuming an OA flux, would we need a type 4 or 5 powder paste to p
Electronics Forum | Fri Oct 25 03:46:37 EDT 2002 | Adam
GUYS HOW SAFE IS IT TO USE RMA FLUX WHICH IS DESIGNED FOR WAVE SOLDERING, TO USE FOR TOUCH-UP/REWORK ? CURRENTLY ALL OUR OPERATORS HAVE LITTLE RE-FILLABLE BOTTLES AND GO AND FILL THEM UP FROM THE FLUX CONTAINERS ( I'M NOT EVEN TOO SURE WHETHER OR NO
Electronics Forum | Tue Dec 17 08:38:30 EST 2002 | Randy Villeneuve
Jim, In most cases if you can eliminate a process you will save money. With that in mind, an all surface mount or all through hole design is prefered. There are alternatives to that rule, like hybrid designs that can be pin and paste soldered. It al
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