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Electronics Forum | Thu Mar 23 10:21:38 EST 2006 | chatech
Recently my company (graphic card suppliers) have experenced some pad to board separation under the processor. I have researched and find that a number of papers have been written about this, but they give no solution, Is anyone out there experencing
Electronics Forum | Mon Mar 27 20:34:22 EST 2006 | ms
Thanks for the suggestion. The large ground pad appears as a single large pad on the component and PCB but we print a matrix of 28 small dots of paste to provide the solder for the joint. The inconsistent volume transfer can occur on any of the fo
Electronics Forum | Wed Apr 19 07:45:50 EDT 2006 | Carol Stirling
Sorry about that. I'd like to post a picture but doubt it's possible. Baseball cap = The pad solder reflows but the BGA ball and the pad don't reflow together in a continuous elliptical shape. Carol
Electronics Forum | Tue Apr 18 23:50:38 EDT 2006 | Sidney
When I rework BGA,PAD came off from PCB. Why does this happen? How should I improve this problem? Thanks!
Electronics Forum | Tue May 23 09:27:37 EDT 2006 | Steve
Sorry I misled you. The PCB pads are wetting, but there is no fillet being formed. After reflow, it looks as though no paste was put down on the pads; however the paste print is fine. All other components solder real nice, it's only the Pd-Ag parts t
Electronics Forum | Fri Jun 09 08:17:07 EDT 2006 | amol_kane
did you look at the pad vs the stencil design? are you putting down enough solder paste on the pads? what are your reduction ratios for these packages?
Electronics Forum | Tue Jun 13 04:42:26 EDT 2006 | yqdeng@gsl.com.hk
What is "Black pad"in ENIG(Electroless nickel/immersion gold), how to solve if it happen in SMD BGA solder joint?
Electronics Forum | Mon Jun 19 05:00:17 EDT 2006 | YQ Deng
Thanks very much! In fact, "Black PAD" phenomenon have been found in our product, the total BGA came off PCB during drop test. if we apply the underfill to BGA after SMD process, Could the underfill add reliablility of product?
Electronics Forum | Thu Jul 20 03:00:53 EDT 2006 | reypal
If you are using SMT machine for component placement you may check your nozzle where in some cases solder paste stuck to it and during placement will easily get into gold pad area. otherwise you have use kapton tape in order not to expose those pads.
Electronics Forum | Tue Jul 18 07:50:47 EDT 2006 | adlsmt
Are the leads actually pulling off the pads or are the pads coming up as well? Did you ever try this "experiment" before you used lead-free?
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