Electronics Forum | Tue Feb 19 16:19:26 EST 2008 | edatasys
Check out http://www.solderstar.co.uk/wavePro.html This tool measures all key wave solder information with a single pass. Wave/PCB contact, immersion depths, etc. Also has a reflow pack to allow use on reflow, 9 channels with predictive software. B
Electronics Forum | Mon Apr 17 19:54:39 EDT 2000 | Dave F
Sounds like a true IR guy to me!!! Your profile should reflow solder on the board properly to produce a reliable product for your customer. If that requires more than one proifile, so be it!!!. That being said, we went from hundreds of IR profiles
Electronics Forum | Wed Aug 07 16:49:15 EDT 2013 | hegemon
You mean you don't pull all of your thermocouples out of the ovens once a year and send them out for calibration? - lol Tough question. You have a calibrated datalogger. (I assume) You have an oven with preset zone temps, each zone controlled by a
Electronics Forum | Tue May 20 08:25:26 EDT 2008 | davef
Well something is different isn't it? * Paste * Part supplier * Board fabrication * Was the profile that you reference the measured temperature or the the settings keyed into the oven? The cross sections seem to show less than expected ball collapse
Electronics Forum | Tue Jan 14 10:48:07 EST 2020 | dontfeedphils
I've worked with these quite a bit in the past as well. As the previous poster mentioned, we ran either 4/5 mil thick stencil with a pretty standard RTS profile in a 10 zone convention oven without issue.
Electronics Forum | Fri Jul 16 15:30:22 EDT 1999 | SMTASSY
Perhaps a little hard to find but is there anyone who uses a vapor phase process to solder populated card with BGAs. I am interested in the success rate of such a process. It is obvious that the throughput is reduce vs a convection oven but still thi
Electronics Forum | Fri Sep 26 12:57:09 EDT 2003 | Angie
We have had some components that popped off in our IR oven. It was attributed to the solder paste. The humidity was above 60% the temp was about 70 degrees.
Electronics Forum | Tue Feb 08 12:36:28 EST 2000 | Charlie
I'm looking for information from both those who do cure glue and reflow past with the same profile and those who have tried and decided against it. What were the problem? What are the limitations?
Electronics Forum | Wed Jun 05 21:33:12 EDT 2002 | davef
Tough to say based on what you have told us. Things to Determine are: * Is the heat at the solder connections that are not reflowing properly adequate? * Is the pad surface of the solder connections that are not reflowing properly solderable?
Electronics Forum | Tue Jan 04 08:02:54 EST 2005 | Mike
Hi!! Where can I get information about Post- and pre-reflow rework? Some links, opinions?? Please Tell me? I would like to know too some methods and cost effective ways,that how we can rework repair printed boards? Thanks!!
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