Electronics Forum | Tue Apr 07 15:55:37 EDT 1998 | Michael Allen
| I'm also in the "Don't score it" camp. Routed breakaways are much better. If your wave solder process has decent control on the wave height, you shouldn't worry about flooding the boards. | The fine pitch consideration for panelizing - Since you
Electronics Forum | Thu Aug 09 12:53:59 EDT 2001 | seand
Hello everyone, First when defining any criteria for process control, one should identify quantiatively that criteria. Then one establishes an effective method for measuring such a criteria. Once you have a test method, your gateway to a solving y
Electronics Forum | Fri Nov 23 14:47:35 EST 2001 | kgroen
Some comments on the previous post: Be careful when looking at the proportion of SMT defects that are solder defects - you may very well find that only a small few of them originate at the screen printing step. As for specification limits for pas
Electronics Forum | Wed Apr 17 12:01:32 EDT 2002 | cyber_wolf
I am Sr. process technician that has been working in the SMT industry for over ten years. I recently had a phone conversation with a major equipment manufacture's service department. The person that I got on the phone in the service department was ve
Electronics Forum | Fri May 31 17:04:02 EDT 2002 | davef
We use boots / shunts er wutt ever you call them to protect solderable component surfaces from wave soldering. Not sure how it would work in your case try: * Kinnarney Rubber 450 Main St. P.O.Box 37 Mantua, N.J. 08051 609-468-1320 fax 7438 http://ww
Electronics Forum | Mon Jul 01 20:45:38 EDT 2002 | davef
Solder mask thickness specifications by fabricators are: * Wet mask: 0.0002 ~ 0.0004� on trace * LPI mask: 0.0002 ~ 0.0008� on trace Liquids usually range between 10 to 13 um (0.00039 to 0.00051") when dried. Liquid resist processes I have seen are
Electronics Forum | Tue Apr 01 09:03:39 EST 2003 | kmorris
Hi: I'm looking for input from anyone who has experience assembling the MLP package on PCBs. We are experiencing solder opens after assembly, and I'm curious to see how others are processing these critters. The part we are using is a Semtech SH3000
Electronics Forum | Wed Aug 27 14:41:49 EDT 2003 | Stephen
Have you checked the temperature profile at the balls? Just because a recipe works "fine most of the time" does not mean it is optimum. Do you have a machine that can measure co-planarity? If I get time I plan on using the MPA to look at co-plana
Electronics Forum | Wed Apr 27 01:20:22 EDT 2005 | Frank
Are you sure about your dimensions? .45mil ball diameter and .8mil pitch, and a body size of 16x8mils is really, really tiny. I assume you mean millimeters and not mils? 1mil = 0.0254millimeters If your stencil is 5mils and your ball diameter is
Electronics Forum | Tue Jul 19 12:12:02 EDT 2005 | chunks
I have a QFP 160 used on 9 different products that had high fall out for "Insufficient Solder". Basically, a leg or two would pop free when inspected occasionally. This same part is used on different size products, located at different area of each
