Electronics Forum | Mon May 26 04:39:49 EDT 2014 | sarason
Damn near impossible. You need to see a real change in the difference between the 2 elements you are reading. So to give yourself any hope run 2 long traces one top one bottom up the length of the board. Then compare to 2 wriggly traces at one end (o
Electronics Forum | Wed Oct 08 11:16:12 EDT 2014 | cbeneat
We are having an intermittent issue with a certain board on our wave solder line, machine is a Vitronics 6922 Delta Wave, leaded process. There are 2 fuse holders on one edge of the board that are not getting solder all the way thru the barrel every
Electronics Forum | Mon Mar 02 23:48:22 EST 2015 | vb7007
Hi We are using Universal carrier for a 2 sided PCB, where the bottom side goes for hand solder the switches after wave. Our issue is, we are getting micro solder balls all over PCB bottom after wave, whereas we got numerous vias, which also turns
Electronics Forum | Tue Mar 03 09:29:48 EST 2015 | rgduval
A couple of things that have helped me with solder ball issues at wave in the past: 1. Flux. Insure good flux coverage on the bottom of the board. 2. Preheat. Insure that the board is sufficiently preheated for the wave operation. Since you're
Electronics Forum | Tue Nov 08 12:05:57 EST 2016 | aemery
Lachrymal, Where are you getting that from. Let me keep this simple because there can be so many variables in modern printing, some you can control and some you can't. Unless you are designing your own PCB's where you can decide how to orient the co
Electronics Forum | Sun Aug 13 22:26:01 EDT 2017 | dawson
Anyone who knows how to prevent such > flaw? > > Tombstones are those lifted components > from one sides. This results in costly and > time-consuming amounts of touch-up and re-work > after the assembly is completed. For the > customers, this e
Electronics Forum | Wed Nov 15 12:52:21 EST 2017 | georgetruitt
IMO – Look into nano-coatings for your stencil and radius all square apertures This should help out with solder paste releasing from the stencil helping with insufficient solder QFN LGA aperture design, try a stencil cut with a few different apertur
Electronics Forum | Fri Sep 07 11:46:29 EDT 2018 | dleeper
Air gap on the PCB is determined the pad spacing which in turn is governed by the component. As long as the PCB designer is following the typical BGA layout best practices; i.e no open via in pad, non-solder mask defined pads, solder mask covered tra
Electronics Forum | Wed Sep 19 10:34:44 EDT 2018 | sarason
Now I have to guess and make a few assumptions. Without looking at the back side of the board my guess is you have some 400-100V diode bridges before the resistor ,zener and the FET . The FET is a 500V 0.85 Rdson NFET. All of this suggests a chopper
Electronics Forum | Thu Mar 28 15:53:49 EDT 2019 | SMTA-Jon
As a CM, we don’t have a lot of input on the PCB layouts we receive. Some engineers/software packages output the paste layer 1 to 1, some do an across the board reduction, and some set each part up individually with different reductions per footprin
