Electronics Forum | Mon Jul 29 17:03:03 EDT 2002 | burb1999
Just setting up a new SMT line and have questions on which profiling product to use. So far the two in consideration are Super M.O.L.E. Gold and Slim KIC 2000... Please share any thoughts, experiences you have had with either and your opinion....
Electronics Forum | Tue Dec 17 08:55:52 EST 2002 | Randy Villeneuve
Grant, The board maybe the problem but how is your oven working? Is it a convection oven and how many zones (top and bottom)? What does your profile look like? If you are unsure and if you only have one oven, send your board to Soltec or Electrovert
Electronics Forum | Sat Feb 01 16:11:24 EST 2003 | Paul Smith
I would suggest scoring if the profile allows, leaving residual material of circa 40 - 50 mil - That is what I do on a 125mil thick PCB width of the pis is approx 200 mil Mouse bites on a board as thick as 135 mil will mean its extremly difficult to
Electronics Forum | Tue Mar 11 14:19:24 EST 2003 | Chris Lampron
Good Afternoon, We have found that the occurance of tombstones is usually related to other parameters. Board design, placement accuracy, paste tack time and thermal profile are the most common. We do use a 2% silver paste to process 0201 components
Electronics Forum | Fri Mar 28 22:01:00 EST 2003 | MA/NY DDave
Hi Yes I agree, yet this subject is about Tombstoning and oven profile or even oven working correctly across the entire product is a sub-set of how one gets those little chip babies to sit and stay where they belong. Flat and Heeling like their mast
Electronics Forum | Sun Apr 13 19:50:20 EDT 2003 | yukim
Hi, We are placing (+) & (-) terminals in SMT. We have just changed the plating of them: from Nickel to Tin (Sn). During the trial, we used the same reflow profile as before changing, and the solder seems different: a bit cold, with some solder paste
Electronics Forum | Wed Jun 11 15:57:39 EDT 2003 | pjc
Frank, ECD (WaveRIDER) and Datapaq (Optimiser) have wave solder machine process control devices. They will check the following: 1. Conveyor speed 2. Preheat Temps 3. Solder Temps 4. Wave Dwell/Contact Times 5. Wave Heights 6. Waves Parallelism Go
Electronics Forum | Wed Jun 18 09:43:42 EDT 2003 | blnorman
We have a line that is double sided reflow and reflow/wave depending on the product being manufactured. We asked Loctite if we could cure our chipbonders with the reflow profile to eliminate having to change oven profiles for each. They said we wou
Electronics Forum | Thu Aug 07 15:41:12 EDT 2003 | gdstanton
To further clarify my question. I'm dealing with mixed solder technologies on a single assembly and am curious how the rest of you guys handle this. Do you use lead based reflow profiles or revert to lead free based profiles? If you haven't seen t
Electronics Forum | Mon Jan 26 21:10:36 EST 2004 | Vinny
I have done acurate profiling which meets the solder paste specifications. The point I am trying to highlight here is also due to the ground plane side being much larger causing the tombstone defect. I have even tried doing a linear profile, it hel
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