Electronics Forum | Mon Jan 24 06:15:38 EST 2005 | David
Hi everyone! Is here anyone, who has experience about closed-loop feedback (AOI) with Pre- and post-reflow rework. I need too some internet links, whic handle by this subject. Thanks!!!
Electronics Forum | Mon Feb 18 15:44:49 EST 2008 | ck_the_flip
Yup! All the major players out there - KIC, Datapaq, and ECD - are all capable of profiling both reflow and wave solder. check them out. www.kicthermal.com www.ecd.com www.datapaq.com
Electronics Forum | Wed Jan 15 11:53:40 EST 2020 | avillaro2020
As far as the large thermal gradient I have on my thick and thermal heavy board, I've done quite a bit to minimize the gradient but not successful. it's like one pad is connected to a signal while the other pad is connected to ground, you can't bring
Electronics Forum | Wed Jun 11 09:35:07 EDT 2008 | grics
Out of curiosity, what is your top side peak temp @ reflow? Have you inspected the boards prior to SMT (at your 5DX machine?) Also, have you tried to run the board through reflow with out any parts or bga placed and inspected? I how long are you in
Electronics Forum | Fri Sep 16 14:12:23 EDT 2011 | jtownsend
Anyone have experience or advice to help prevent SMT reed switches from being blow out of position during re-flow? We are using a Heller 1707 MK 3. Is it possible to adjust air flow in the oven or do we need to glue before placement??
Electronics Forum | Tue May 20 06:00:33 EDT 2008 | roc2x
Im qualifying a new PCB. I run 2 diff supplier. Supplier A has Zero failure. Supplier B has 4 failure all having Lifted PAD on Bga same location and same location pads that lifted. How can I prove that the PCB have problem? Input : Both run in same o
Electronics Forum | Fri Sep 16 19:46:55 EDT 2011 | jlawson
I have seen this on Heller1707 machines also for LED devices. The same job was run on anthoer brand oven (Rehm) and no issue. I think Heller Blower velocity can be a little on higher side as is a low inertia heating system and they have to make up f
Electronics Forum | Fri Dec 07 06:05:58 EST 2018 | cyber_wolf
63/37 goes from solid to liquid. It melts and solidifies at a single temperature. You can add a percentage of silver and get a slight "pasty range" for a couple seconds. I have never seen a temperature change in a profile keep this from happening w
Electronics Forum | Mon May 13 06:38:41 EDT 2019 | relaycz
You need to give us a little more information. 1. What is the size of your panel? 2. Are there any heavy components? 3. What is the thickness of your board panel? 4. What kind of oven are you using? 5. Is it only a recent problem or ongoing one?
Electronics Forum | Thu Sep 10 17:38:30 EDT 1998 | Dave F
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
