Electronics Forum: 2.. (Page 823 of 1147)

Re: Modification of Fuji machine

Electronics Forum | Fri Oct 23 14:22:44 EDT 1998 | Y.F. Michael Kou

| We currently using the Panasert SMT machine where PCB flow | direction were from right to left, & we are planning to move | in the FUJI -CP3 & CP4-2 in line where standard PCB | flow direction were left to right. | Any comment on FUJI machine modif

Re: Modification of Fuji machine

Electronics Forum | Mon Oct 26 18:50:55 EST 1998 | Phillip Hunter

| We currently using the Panasert SMT machine where PCB flow | direction were from right to left, & we are planning to move | in the FUJI -CP3 & CP4-2 in line where standard PCB | flow direction were left to right. | Any comment on FUJI machine modif

I agree Dave.

Electronics Forum | Tue Oct 27 09:57:37 EST 1998 | Dave

I completely agree with what Dave said previously about the trimming process. I spent the first 6 months at my current job removing this process from our assembly floor. We had several problems with the process including: 1) "flags" from the leads

Re: In-line lead trimmers

Electronics Forum | Mon Nov 16 07:08:54 EST 1998 | Michel SORGIUS

We have board handlers for automatization of lead trimmers. Michel | I have been requested to explore the possibilities of using an inline lead trimmer in our manufacturing process. I have a few questions I need answered. | 1. Can anyone recommen

Re: GEM SECS interface

Electronics Forum | Fri Oct 23 15:15:51 EDT 1998 | Dave f

| I am looking for detailed information on the SECS 2 protocol that is part of the SEMI General Equipment Module interface. I was not able to get detailed information from the SEMI web site and was not able to find anything on the web. | | I am look

Package tilting during assemly

Electronics Forum | Tue Oct 20 03:22:52 EDT 1998 | Viswanath Valluri

Hello : Some of the recent FBGA (a Chip Scale Package) packages that I am looking into have body sizes having aspect ratio's 2:1. In particular, body sizes of 14x8mm, 15x8 mm etc. The ball count for this particular package is around 40-68 I/Os. My qu

Re: Package tilting during assemly

Electronics Forum | Fri Oct 23 15:19:38 EDT 1998 | Dave f

| Hello : | Some of the recent FBGA (a Chip Scale Package) packages that I am looking into have body sizes having aspect ratio's 2:1. In particular, body sizes of 14x8mm, 15x8 mm etc. The ball count for this particular package is around 40-68 I/Os. M

Re: Dicing Operation

Electronics Forum | Wed Oct 21 08:16:40 EDT 1998 | Andy

| Hello everybody | | This is kind of urgent for me. I would appreciate if anyone of you could tell me where could i find information about the different dicing techniques and operations used in the industry. | | I need information about the fol

Re: Help with new placement equipment

Electronics Forum | Thu Oct 15 12:18:02 EDT 1998 | Rudolf Kappel

Please have a look on the internet ... mimot.com. They offer a low volume, high mix system. Kind regards Rudy | I need to install some new lines for high mix low volume products in an already cramp building. Could someone share any info about the

Re: Help with new placement equipment

Electronics Forum | Thu Oct 15 17:17:15 EDT 1998 | Justin Medernach

| I need to install some new lines for high mix low volume products in an already cramp building. Could someone share any info about the machines which give you the best bang for floor space. I need a 2 machine system for placing 0402 to fine pitch,


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