Electronics Forum: bridge (Page 83 of 104)

SMT Samtec dual edge connector assembly help

Electronics Forum | Wed Jan 08 16:27:11 EST 2020 | rmitchell

We have a PCB with the dual sided connector that slides on from the edge and has leads on the top and bottom sides of the PCB. It has 20 leads on each side of the PCB with with about .8mm pitch. The PCB also has a gold grounding strip on the edge fo

solution to design challenge (ubga, NSMD pads, heavy traces)

Electronics Forum | Wed Mar 18 11:27:24 EDT 2020 | slthomas

I am about to order a stencil and I can already see that I'm going to have issues. I'm hoping someone has a recipe for this scenario that we haven't tried yet. The parts are 16 mil pitch bga's, the pads are NSMD (10 mil dia. with 12.6 mil mask open

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Thu Mar 25 23:23:00 EDT 2021 | llawrence

The QFP pitch is 0.5mm. Pad size is 1.475 x 0.3mm, and the new aperture size is 1.32 x 0.22mm. I'm not sure about whether or not it is lasered, but on the newly ordered stencil I selected the polishing option. Looks like the pad width is already 2/3

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Fri Mar 26 15:48:31 EDT 2021 | grahamcooper22

Leaded HASL on small pads can be quite difficult to print on...the HASL tends to be domed rather than flat..and that can affect print quality...you really need a perfectly flat pcb pad to print paste on when you are assembling 0.5mm QFPs. If the pcb

Re: 63/37 vs 65/35 solder

Electronics Forum | Tue Jul 27 14:09:51 EDT 1999 | JohnW

| | | We are currently using a 65/35 solder for our wave process but are considering switching to a 63/37 for a substantial cost savings. No one here seems to know why we everused a 65/35 formulation in the first place. | | | I understand 63/37 to be

Re: Off Pad Printing

Electronics Forum | Tue Jun 29 16:03:57 EDT 1999 | Dave F

snip | John and Dave, | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like placing 0603's on 0402 pad

Re: Squeegee Speed

Electronics Forum | Mon Feb 22 14:21:14 EST 1999 | Rick Wyman

| | Hey all- | | | | My question is this: My stencil printer operator has said that he has to | | wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch | | aperatures for a QFP to release well. We are using Amtech NC-559 type 3 |

Re: DFM Guidelines or solderability?

Electronics Forum | Thu Aug 20 15:29:45 EDT 1998 | D. Lange

Re: Questions #2 Are you having solderability problems with that arrangement? Sounds like problems could be solved at the wave solder. If the customer has already spun pcb then sometimes for low volume it would be easier to correct the problem at wa

Re: Green coating and through-hole plating

Electronics Forum | Fri Aug 14 07:27:42 EDT 1998 | Earl Moon

| | Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! | | Xingsheng | Xingsheng: Welcome. | Bible on PCB fabrication: Printed Circuits Handbook, Clyde Coombs, McGraw-Hill | Web resources: http://www.pw

Re: Green coating and through-hole plating

Electronics Forum | Fri Aug 14 08:59:51 EDT 1998 | Dave F

| | | Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! | | | Xingsheng | | Xingsheng: Welcome. | | Bible on PCB fabrication: Printed Circuits Handbook, Clyde Coombs, McGraw-Hill | | Web resources: htt


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