Electronics Forum | Thu Apr 15 20:41:22 EDT 2004 | Ken
There are ledgitimate reasons for checking furnace calibrations, but let me clarify what that is. 1. TC's are not necessarily calibrted. Not unless you need "absolute" accuracy. TC's operate against a (non-linear) standard +/- a tolerance. Most
Electronics Forum | Wed Apr 21 19:59:43 EDT 2004 | Ken
It makes no difference if the solder is in balls, ingots, bars, paste etc. The thermal profile satisfies key areas of the reflow process as a function of your flux and alloy type. Peak and duration above liquiduous are a function of the alloy. pr
Electronics Forum | Wed May 19 04:27:18 EDT 2004 | johnwnz
Also look at IPC 7095 which is all abotu BGA processes including rework. the profile will be 100% based on your board - how many layers, how many are ground & signal, how many of those are the BGA connected to directly or indirectly, the component we
Electronics Forum | Mon Jun 07 21:26:03 EDT 2004 | davef
First, voiding is a process indicator. Next, as you say, the profile is a significant contributor to void formation. Finally, when considering the "material factors" that drive void formation, solder paste formulation is the most critical. Discuss
Electronics Forum | Sat Jul 03 01:14:24 EDT 2004 | bcceng
Not necessarily on inspection but in reliability. Do you want to ship product that will last only a few years or product that can last more than five years? X-Ray process will let you know if you have exposed your BGA's to an aggressive profile or a
Electronics Forum | Tue Aug 10 14:50:59 EDT 2004 | C Lampron
Snehal, Look at the spec sheet for the paper phenoline PCB. Look at the max temp. If it is at or lower than 183 degrees C, here lies the problem. If it will withstand higher temps at a shorter durration, you can possibly speed up the belt but like D
Electronics Forum | Mon Dec 13 14:57:41 EST 2004 | DasonC
I run a D.O.E. and print different water soluble pastes on the same board by mini-stencil and reflow on same profile. WS709 is one of them but Indium6.2 shown less and no void then WS709. P.S.: profile may affect the result. Do U have Via in pad?
Electronics Forum | Wed Dec 15 08:15:10 EST 2004 | pjc
UP78 is an old product. Data sheets are no longer posted on the web site. OM-5100 is the replacement. Try calling tech support and they should e-mail you the UP78 data sheet that will show the profile curve. Jersey City, NJ Tel: 201-434-6778 http://
Electronics Forum | Thu Feb 17 15:54:35 EST 2005 | JB
Most of our profiles are a variation of one another. Depending on the thicknes and density of the PCB, we make the nescessary changes and then we profile it, to make sure it meets our specs. Check this out: http://www.smtnet.com//forums/index.cfm?
Electronics Forum | Thu Mar 24 09:53:03 EST 2005 | aj
Doug, We are getting ready to do some trials at the moment. I have profiled the oven and achieved the Required Temps. that would be desirable. I dont envisage any problems what so ever aslong as who ever is doing the profile fully understands the
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