Electronics Forum | Thu Dec 09 15:14:41 EST 1999 | Ron Costa
I have been seeing wetting problems with Texas Instruments componets. I am using Kester 596L OA water soluble solder paste. My reflow profile is in spec. for this formula. Has anybody else seen this problem and if so how did you resolve it? Any feed
Electronics Forum | Wed May 28 05:31:17 EDT 2003 | dougie
Hi, Can someone please give me an IPC standard number or similar for decal design when wave soldering SMT components on the underside of a board. Hopefully a document exists detailing design rules, the components ideal attitude to the wave, suitabil
Electronics Forum | Wed May 25 17:29:58 EDT 2005 | Peter
We are evaluating a low halide Water soldering flux (Aim WS716). Has anyone had good/bad experience with it? Our operator has mentioned strong and irrating smell, even when standing a foot away from the conveyor entry/exit. The fluxer is embedded w
Electronics Forum | Tue Jul 12 08:44:58 EDT 2005 | jdengler
JBC is offering "Lead free" tips now. They have this on the web site: "JBC recently released a new series of tips featuring a thicker iron bath that we find more resistent to aggressive additives and flux as found in lead free alloy." We have not d
Electronics Forum | Thu Jul 06 12:52:35 EDT 2006 | samir
..and he can put the flux in and keep it a secret too from his customer.. RSS profile on wave?? I never heard of a soak zone for wave preheat...you may be burning off your activator..hence, the beads. For wave preheat, your main goal is to ramp up
Electronics Forum | Wed Sep 13 09:15:19 EDT 2006 | Rob
Hi Peter, Out of the 1.5 billion components we shipped last year, we had 3 components back for solderability issues. All 3 had been taken out of their vacuum packaging and left to oxidize for a number of weeks. We don't see it as an issue, but we
Electronics Forum | Mon Mar 03 02:11:35 EST 2008 | andrzej
I am working on instruction for potential customer about PCB design guidelines to make it easy for wave soldering (not selective). I have experience and have already gathered some info but I still need exact information about dimensions and distances
Electronics Forum | Mon Aug 30 10:17:16 EDT 2010 | markgray
We currently use this devise in one of our designs with no issues. We are using a 3mil stencil and a 45% apperature reduction. It is virtually impossible to eliminate voids but they are in an acceptable range. Solder balls are caused on this componen
Electronics Forum | Thu Sep 09 05:23:10 EDT 2010 | 15009
You can reduce and almost eliminate voids and other paste related defects in LGA's BGA's, QFN's etc, by using solid solder deposit. Its been around for 24 years, 13 in the US. It is now included in the new IPC 7093 specification for bottom terminat
Electronics Forum | Fri Apr 27 08:19:04 EDT 2012 | jim_n_hky
Can anyone offer guidelines on DFM and process recommendations for soldering .050" pitch connectors in the wave. The initail design had .026" drill with .043" pads so only .007" between pads. I requested .035" pads, but this still only leaves .015" b
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