Electronics Forum: you (Page 824 of 3793)

Electrically-Conductive Tapes application advice?

Electronics Forum | Sun Aug 02 19:47:16 EDT 2009 | isd_jwendell

Now that I've seen the pics... Soldering could work just fine. If you are going for large production then you could get copper discs cut and mounted in tape carrier ($$). This would make it very easy for automated equipment to assemble. Mounting a

Leaking Wave Solder Pot Electrovert Stainless/SN100C

Electronics Forum | Thu Sep 03 10:14:01 EDT 2009 | bk

Probably you can weld the spot that is leaking as a temporary fix.As for a long term solution, I would probably go with a lead free retrofit kit.It is basically a titanium insert that you place into your existing pot and it is cheaper then buying a n

Bubbles on solder joint(after conformal coating curing)

Electronics Forum | Mon Dec 28 09:12:56 EST 2009 | kpm135

@tommyg_fla According to the TDS the recommended coating thickness for Humiseal 1B31 is only 1-3 mils so if I had to guess I would say your issue might be that you're re-coating over the first pass too soon. All the solvent hasn't evaporated and the

AOI 2009 MIRTEC MV-7xi 5 MP or Yes tech YTV-FX 5MP

Electronics Forum | Mon Dec 07 09:49:00 EST 2009 | oeidave

Dany, Thank you for posting your question. At Omron Electronics, we believe, and consistently are proven to be the leaders in Solder Joint inspection. We have been manufacturing AOI systems longer than any other company in the market and are often i

ICT and specifying PCBA testing

Electronics Forum | Fri Nov 18 12:35:15 EST 2011 | rway

As the article eludes to, you still need probe access to measure the pins with TestJet. One thing I wanted to add was the use of JTAG for use with Boundary Scan. Certain devices have JTAG capability, but not all JTAG devices are Boundary Scan compa

BGA Placement Process

Electronics Forum | Fri Mar 26 10:35:52 EDT 2010 | grahamcooper22

Hi Krish, thanks for your detailed reply. Sorry I assumed you may be using a solder paste to solder the BGA to the pcb. Either solder paste or Gel flux is best for resoldering BGA to pcb. Are you using Gel flux ? Most popular long term storage for mo

philips Eclipse-II

Electronics Forum | Sat May 29 02:20:08 EDT 2010 | vinitverma

Mch Adjust > Adjust Target > Laser Unit > Nozzle Position. Here the laser will automatically detect the centre of the nozzle. Remember - It'll give you the option of using a component for the test but DON'T use any component. Let it detect the centre

Solder paste transfer from jar to cartridge

Electronics Forum | Tue May 11 15:56:10 EDT 2010 | davef

First, you mix the paste in the jar with the centrifugal thing-a-ma-jig. Then what? So, how are you going to get the paste from the jar into the syringe [cartridge], anyhow? Are you going to use an Atlas Tool? How are you going to de-air the syri

Reflow Oven

Electronics Forum | Tue Jun 08 17:51:37 EDT 2010 | vmorina

Hi Vee, We are planing on doing low-medium volume and prototyping boards with the following packages. TQFP, BGA and other SMT packages. I would like to go with some thing like batch/tabletop oven for now, but I am not excluding conveyor reflow oven

Line Capacity

Electronics Forum | Fri Jul 09 18:48:55 EDT 2010 | rway

I hope I understand your question, but are you saying you're having trouble meeting demand? Keep a log of the time that the machines are down, probably for 4-6 weeks would be good and this may give you a good idea of what kind of downtime your worki


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