Electronics Forum | Thu Sep 29 20:26:58 EDT 2005 | DasonC
Any aperture/stencil thickness suggestion to provide a rigid solder joint for 0.8mm pitch PBGA with 0.4mm ball diameter. The pad is based on IPC7095 and it is 0.3mm. Thank!
Electronics Forum | Tue Jun 13 08:33:11 EDT 2006 | davef
IPC-2222, 5.3.1 defines the parameters of making scoring cuts and the tolerance of the cuts, but does not specify the cuts. Our spec for 0.062" thick FR-4 boards is: 0.018-0.024"
Electronics Forum | Thu Apr 16 21:24:47 EDT 2009 | davef
500||0.00305mm/V||0.005mm/V||0.0254mm/V
Electronics Forum | Wed Sep 16 03:17:47 EDT 2009 | geb
The solder wire uses a ORL0 flux. The wire contains less flux at around 2.0-4.0%.
Electronics Forum | Tue Feb 23 13:21:25 EST 2010 | davef
Gregp How does MASCOT for PCB Assembly [Robotas Technologies Ltd, Broadlands House, Foxendown Lane, Meopham, Kent DA13 0AE; +44 (0) 1474 815815 F+44 (0) 870 005 6914 robotas.com] match-up with the Contact CS-400E machine?
Electronics Forum | Wed Apr 07 03:44:40 EDT 2010 | jackevest
The missing rate spec. of normal machine is under 0.3%, for our experience 0.1% is normal for average, if you can maintain the machine well, like the nozzle cleaning, feeder maitain...you can keep the 0.05%.
Electronics Forum | Fri Dec 13 10:06:05 EST 2013 | davef
For vertical mounted, axial leaded components; the standoff from the land to the component body should be 0.4mm[0.016in] to 1.5mm[0.059in]. Right?
Electronics Forum | Sun Jul 20 14:55:25 EDT 2014 | bobpan
Typically when this happens the lighting in your package for a part in one of those cycles has 0 0 0 in the 3 light settings. You need to check all your package types that are used in your program and makes sure they are adjusted correctly. Good Luc
Electronics Forum | Mon Sep 18 01:47:18 EDT 2017 | bukas
I would go with wire thickness + 0.4 to 0.8 mm for pad width, and pre-tinned lenght + 0.5mm what seems to me like problem is that it can easily roll off the pads in reflow oven
Electronics Forum | Tue Aug 20 21:39:29 EDT 2019 | sssamw
6 mil (0.15mm) for the 1.13mm pitch BGA, and 4 mil (0.1mm) for the smal QFN with 0.4mm pitch.
.png)
