Electronics Forum | Tue Jan 31 13:55:56 EST 2006 | samir
Anyone know what the general rules / requirements are for micro-BGA's and CSP's as to when capillary underfill is required? (ie size of bump/ball, package thickness, PCB/CSP thickness ratios, etc).
Electronics Forum | Mon Jun 19 05:00:17 EDT 2006 | YQ Deng
Thanks very much! In fact, "Black PAD" phenomenon have been found in our product, the total BGA came off PCB during drop test. if we apply the underfill to BGA after SMD process, Could the underfill add reliablility of product?
Electronics Forum | Mon Jan 21 18:58:21 EST 2008 | davef
We have read papers espousing using xray, but have never seen such a thing. It seems the contrast provided in the xray images is insufficient for analysis of the underfill.
Electronics Forum | Tue Jan 22 09:48:09 EST 2008 | davef
Here's an article on flux / underfill compatibility http://ap.pennnet.com/articles/print_toc.cfm?p=36&v=16&i=6
Electronics Forum | Tue Jul 27 15:37:35 EDT 2010 | bandjwet
Can someone recommend a vendor for underfill for a flip chip on FR4 application? This would be someone with actual availability in the US (as opposed to the many others with stock in China). Thanks Bob Wettermann BEST Inc
Electronics Forum | Tue Jul 27 15:57:40 EDT 2010 | scottp
We use underfills from Namics and Lord Corp in our US plants for flipchip on FR4.
Electronics Forum | Tue Jun 11 14:53:06 EDT 2013 | emeto
I am not sure that underfill and rework can get along. these boards might be scrap already. You need to get more information about the underfill(manufacturer, supplier...)
Electronics Forum | Wed Sep 09 10:37:40 EDT 2020 | SMTA-64386317
Hi, Anybody knew what is appropriate bump height for BGA that will be ideal for underfill process. The undefill must be strong enough to hold the component.
Electronics Forum | Thu Oct 01 18:06:27 EDT 2020 | proceng1
We are looking to underfill a small QFN and have never done this before. I have read the data sheet, but I have specific questions. Does anyone have experience using Loctite Eccobond 1216M?
Electronics Forum | Fri May 22 15:37:23 EDT 2009 | 1smtdude
Depending on the material chosen, it's possible to �rework� underfilled components. However, it's far from a production process. Two steps are usually required. First: remove the package from the PCB. Second: remove the residual underfill from the P
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